weird taught, FCPGA with a slotket cools better than a FC on the socket370.

[andylawcc]

based on the experience with my MS 6309,
on a socket board, the backside of the cpu is trapped with hot air, as the case and the mobo block any possible airflow.
in contrast, on a Slot Board with a slotket, the back side of the cpu Maybe cooled easily by the case fan.

so a Slot1 board can oc more?

 

[ahfung]

Same here, my 550E@any speed full load is now 7-8C hotter on my Epox BX7+ (S370)than Abit BF6 + IWIll Slocket2.

But I don't really think that FCPGA on slocket will have better cooling than on S370. In my case the backside of IWill Slocket2 PCB is covered with plastic too.

 

[Midnight Rambler]

So how do you explain the temperature increase when you went to the S370 board?

 

[LXi]

That could be true, but we really shouldnt worry about it since Intel is making the move towards pure Socket 370 now. Also, base on your experience, which Slot1 board did you use?

 

[mschell]

The onboard thermal diode imparts varying restive values to the temperature monitoring circuit, it's possible that the slocket changes the baseline values in the circuit causing a different reading. A good way to check the baseline is to check the values as quickly as possible after bootup. Similar baseline values will display similar temps until the heat load cannot be dissipated by the less efficient setup(MB socket??).
If the baseline starting temps appear similar then a possible explanation is the chip being locked down to the motherboard socket could pick up some heat from the motherboard itself but this is unlikely as the chip usually runs much hotter than the board. - M.

 

[SUOrangeman]

Anyone remember the point of the flip-chip design? It basically exposes the real "meat" of the chip and thus applies cooling directly too it. You *may* not need to cool the other side of the pillow.

Just a thought.

-SUO

 

[StanTheMan]

really?