Originally posted by: Calin
However, there is a "heat transfer resistance" between the processor core (where heat is generated) to the inside of the waterblock (where water take that temperature). This is the core-to-heatspreader area, the heatspreader-to-waterblock area and waterblock-to-water. By reducing the temperature of the water in the waterblock to ambient, the actual temperature of the waterblock might be ambinent + 1F, the heat spreader could be ambient + 4F, and the core ambient+5F. Remember, when the temperatures of two materials in contact are the same, no heat exchange take place! You need different temperatures to have heat transfer.
The cooler the cooling fluid is, the cooler the core - but the processor will be hotter than the cooling liquid
You're right that this heat transfer resistance exists. However, this needs some clarification. Within the heat transfer surfaces (heat spreader, water block), the thermal conductivity that occurs is governed by Fourier's law of heat conduction, which states that the heat flux is proportional to the temperature gradient across the part under consideration. The proportionality constant is the thermal conductivity of the metal (very high for copper, silver), which will be approximately constant over the small temperature ranges considered in these systems. So, then, if the thermal gradient across the heat spreader/waterblock (read: temperature difference between the water and the core) is very high (water is much cooler than the core), the heat flux will be very high. The larger this gradient is, the greater the flux will be. Thus, this heat transfer resistance is not fixed and may be readily decreased by using a colder and colder heat transfer fluid. This is exactly why liquid nitrogen and similar cooling techniques are so effective at generating uber-low temperatures.
Now, when considering the liquid-waterblock interface, the heat transfer is no longer governed by Fourier's law. It's governed by a simple convective heat flux: q=h(Tw-Tf), where q is the heat flux, h is the heat transfer coefficient, Tw is the wall temperature, and Tf is the fluid temperature. The heat transfer coefficient increases with velocity according to the Chilton-Colburn analogy (Prandtl Number varies with Reynolds Number). Thus, if you ramp up the velocity, the Reynolds Number (ratio of inertial to viscous forces) increases proportionally, as does Prandtl number (ratio of resistance to energy transfer to momentum transfer). The relationship between velocity and heat transfer coefficient is, therefore, somewhat complex, but they're strongly related.
So, by increasing the velocity in the loop, you increase the heat transfer coefficient. When this is increased, the heat flux from the waterblock approaches that of the fluid. When this happens, the thermal gradient from the core to the fluid decreases.