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Using Intel stock HSF, change TIM?

Charlie98

Diamond Member
Noob Question #1: I'll be using my stock Intel HSF (actually the HSF from my 2500K) on a G620 in my HTPC build. Although Intel graciously put TIM on the base already, would it be a better idea to strip it off and add a different TIM? (AS5, etc...)

Noob Question #2: My 212+ base is square like the lid on my 2500K... the base on the Intel HSF is round and doesn't cover the entire die lid... Just curious if the Intel cooler is up to the task. (Dumb question, I know, Intel wouldn't supply them if they weren't... but are they really?)
 
Q1: it won't hurt, but I don't know if the advantage will be worth the effort. Totally up to you. If the Intel heatsink was used in a previous build, you definitely should put on new material.

Q2: The heat spreader does as the name implied, but the heat is still concentrated in the center, where the die is.
 
Q1: it won't hurt, but I don't know if the advantage will be worth the effort. Totally up to you. If the Intel heatsink was used in a previous build, you definitely should put on new material.

Q2: The heat spreader does as the name implied, but the heat is still concentrated in the center, where the die is.

Check and Check.

No, I went straight to the 212+ with my 2500K, so it's virgin.

I didn't know where the heat was on the CPU... I never really compared the bearing surfaces between the two coolers until just this week... it just seemed kind of odd.
 
No, I went straight to the 212+ with my 2500K, so it's virgin.

I did the same with mine. Still got the heatsink in the box. As you have discovered, those things are handy to keep around. Put the last one I saved on a build for my parents.
 
I did the same with mine. Still got the heatsink in the box. As you have discovered, those things are handy to keep around. Put the last one I saved on a build for my parents.

Thing is, the 2500 Intel HSF has a copper base, the G620 is aluminum... hence the reason I'm going with the 2500's. Everything else seems to be identical.
 
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