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Ultra 120 versus Ultra 120 Extreme

IMO they're both great heatsinks, just depends on how much you want to spend, the original 120 is probably a little cheaper...I use one in my rig and it's awesome.

There are so many variables that go into good air cooling, air flow in the case, heatsink efficiency, which fan you use, etc, etc....you can't go wrong buying either the Ultra 120 or Ultra 120 Extreme, they're both fantastic.
 
Anand had an article that clearly shows the TRUE to be better. Frostytech's experiments are iffy sometimes. They'll give you a good idea of how good a cooler is; but their data can be off so don't necessarily believe their conclusions.
 
why? you don't trust anandtech?
Also to be noted is that you need to lap the TRU/TRUE and your CPU (depending on what you have) because both are likely not perfectly flat.
 
Originally posted by: ther00kie16
why? you don't trust anandtech?
Also to be noted is that you need to lap the TRU/TRUE and your CPU (depending on what you have) because both are likely not perfectly flat.
Click to expand...

He never said he didn't trust AT. Don't you look up multiple reviews before purchasing? If you base your decisions on on one source your not any better than the average person.

Also having to lap is entirely false too. Yes, Thermalright bases for some reason are concave however how concave they are varies. So it is best to check how flat the base is, if it isn't bad it's not going to be worth the effort to lap it.

Also OP, the only difference between the two is the extra heatpipe. Personally, I'd just get an Xigamtek S183 (cause the S184 in some cases perform worse) which actually is shown to be better than the TRU120E. On top of that you get a fan with the heatsink and don't have to worry about lapping (sames it's exposed heatpipes).
 
Originally posted by: Quiksilver
Originally posted by: ther00kie16
why? you don't trust anandtech?
Also to be noted is that you need to lap the TRU/TRUE and your CPU (depending on what you have) because both are likely not perfectly flat.
Click to expand...

He never said he didn't trust AT. Don't you look up multiple reviews before purchasing? If you base your decisions on on one source your not any better than the average person.

Also having to lap is entirely false too. Yes, Thermalright bases for some reason are concave however how concave they are varies. So it is best to check how flat the base is, if it isn't bad it's not going to be worth the effort to lap it.

Also OP, the only difference between the two is the extra heatpipe. Personally, I'd just get an Xigamtek S183 (cause the S184 in some cases perform worse) which actually is shown to be better than the TRU120E. On top of that you get a fan with the heatsink and don't have to worry about lapping (sames it's exposed heatpipes).
Click to expand...

Well, I thought Anandtech's review was well done and clear enough. I've looked up other reviews as well and TRUE is still better once lapped. Otherwise, there's no performance gain in spending extra for a TRUE over say a Xigmatek. That's what I meant.
 
Just to add to the lapping bit --- If you lap the heatsink (any) and not the processor too you can in some cases end up with worse temps than what you started with(eg. non-lapped heatsink and processor).
 
Originally posted by: Quiksilver
Just to add to the lapping bit --- If you lap the heatsink (any) and not the processor too you can in some cases end up with worse temps than what you started with(eg. non-lapped heatsink and processor).
Click to expand...

Could you explain this?
 
Originally posted by: ZzZGuy
Originally posted by: Quiksilver
Just to add to the lapping bit --- If you lap the heatsink (any) and not the processor too you can in some cases end up with worse temps than what you started with(eg. non-lapped heatsink and processor).
Click to expand...

Could you explain this?
Click to expand...

He's going off the disinformation TR spreads about how their bases are convex (or concave, depending on your luck of the draw) by design so that they spoon perfectly with your CPU IHS which is concave (or convex, depending on your luck of the draw). So if the stars align properly and you do happen to have a cooler and CPU that spoon perfectly, lapping one but not the other will result in an imperfect spoonage and potentially worst temps. Look around the web, you'll see there is no consistency at all with the curvature of the base or IHS, the differences are due to poor QC and that's all.

The best approach is to just lap both before you start and save yourself a few heatsink/motherboard removals. I just went through this process this weekend and the difference between lapped and non-lapped is extreme (13C under load, 3.6GHz @ 1.38V).
 
Originally posted by: chizow
Originally posted by: ZzZGuy
Originally posted by: Quiksilver
Just to add to the lapping bit --- If you lap the heatsink (any) and not the processor too you can in some cases end up with worse temps than what you started with(eg. non-lapped heatsink and processor).
Click to expand...

Could you explain this?
Click to expand...

He's going off the disinformation TR spreads about how their bases are convex (or concave, depending on your luck of the draw) by design so that they spoon perfectly with your CPU IHS which is concave (or convex, depending on your luck of the draw). So if the stars align properly and you do happen to have a cooler and CPU that spoon perfectly, lapping one but not the other will result in an imperfect spoonage and potentially worst temps. Look around the web, you'll see there is no consistency at all with the curvature of the base or IHS, the differences are due to poor QC and that's all.

The best approach is to just lap both before you start and save yourself a few heatsink/motherboard removals. I just went through this process this weekend and the difference between lapped and non-lapped is extreme (13C under load, 3.6GHz @ 1.38V).
Click to expand...

Wasn't quite the way I was looking at it; I was more or less thinking about how the thermal paste would spread about. For example, you lap the heatsink but not the cpu ihs (which happens to be slightly concave) wouldn't you end up with a thin amount of thermal paste in the center where the concave ihs meets flat heatsink surface and the rest of the paste is pushed off to the sides where there is a greater gap? It just seems likely the temps would be worse or highly uneven due to more the larger amount of thermal material for heat to travel through.
 
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