This frees up 3D XPoint to use a multi-layer structure, though not one that is as easy to manufacture as 3D NAND flash. This initial iteration of 3D XPoint uses just two layers and provides a per-die capacity of 128Gb, a step or two behind NAND flash but far ahead of the density of DRAM. 3D XPoint is currently storing just one bit per memory cell while today's NAND flash is mostly storing two or three bits per cell. Intel has indicated that the technology they are using, with sufficient R&D, can support more bits per cell to help raise density.