- Jun 21, 2005
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TSMC sees Q3 demand as it solidifies roadmap
09/02/2009
TSMC continues to move full speed ahead on new technology. In an interview with EE Times, Jack Sun, vice president of R&D at TSMC, insisted that the company is on schedule with its upcoming 32- and 28-nm processes.
The previously-announced, 32-nm process is a half-node technology, which is targeted for production by year's end. ''Everything is on target,'' Sun said. ''We are in the qualification stage. Tape-outs (will occur) very soon.''
http://www.eetimes.com/showArticle.jhtml;?articleID=219501118
TSMC invests in downturn, tips 22-nm
04/21/2009
At present, the company is ramping up its 40-nm process. It is also on track with its latest 28-nm process, said Jack Sun, vice president of R&D at TSMC. Based on high-k and metal gates, the recently-introduced 28-nm process is due out in the first part of 2010.
TSMC plans to roll out its 22-nm process ''two years after 32-nm,'' Sun said. TSMC is set to ship 32-nm by the end of 2009. Its 28-nm process is due out in the first part of 2010.
http://www.eetimes.com/showArticle.jhtml;?articleID=216900470&pgno=2
TSMC confirms 40-nm yield issues, gives predictions
04/30/2009
As previously reported, TSMC is expected to move into 28-nm production in the first part of 2010.
http://www.eetimes.com/showArticle.jhtml?articleID=217201043