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too much thermal compound?

D

DaiShan

Diamond Member
This is the first time I tried to put together a system since my old socket 7, I put the amount of thermal compound that came with the heatsink on the bottom of the heatsink and attached it to the processor, windows was having stability problems that I couldn't fix, so I took it into a shop for them to look at, they told me that I put too much thermal compund on and burnt up some of the brideges which was causing my problem, my question is what is the correct way to apply thermal compound?
 
with thermal compound, less is MUCH BETTER. you want an extremely thin layer...and you want it only over the core...anywhere else and you definitely do risk shorting something out.

check out the guide on arcticsilver.com for applying their thermal compound...it's the best way to apply any HSF goo
 
What thermal compound came included? Was it a metal based (silver or copper)? If not then I have no idea what that shop is talking about. It is possible to put too much compound on, but it only lowers performance.

It would of had to of been metal based to have any effect on your bridges. And the general rule of thumb is to put only a thin coat of compound on the core only.
 
Basically the thinnest layer possible. It is only there to fill in microscopic pits and grains in metal surfaces. That is the rule . . . and different compunds have some variances, so check the instructions relating the kind you are using.
 
Cover your index finger with kitchen plastic wrap. Place a tiny drop of compound (about half the size of a bb, maybe even less) on the tip of your finger. Smooth out the drop on the end of your finger a bit so you don't get a big glop on the die them smooth it thinly onto the die with your finger. Very easy to get it smooth, keep from getting it in the wrong places and control the amount this way.
 
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