- Jun 25, 2004
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I'm not familiar with all of the die variants with Haswell, but as an example, I assume desktop i5's are cut from the same wafers as i7's. 2MB of cache is disabled, as well as the transistors used in hyperthreading. How much die space is unused in an i5? Or, from a different perspective, what percent of defectives can be made into an i5? Does Intel bin i7's with less than all of the cache working as i5's, or do they always fuse off the same parts? How does their scavenging/binning differ from other companies, like AMD, nVidia, etc.?
Are the transistors associated with AVX a large part of the die in dual core models?
AFAIK, iGPUs now take up a majority of the die space in 1150 chips. What kind of binning/harvesting does Intel use here? Wouldn't it make sense then to offer GT1 variants of quad core chips if trying to maximize yield?
Are the transistors associated with AVX a large part of the die in dual core models?
AFAIK, iGPUs now take up a majority of the die space in 1150 chips. What kind of binning/harvesting does Intel use here? Wouldn't it make sense then to offer GT1 variants of quad core chips if trying to maximize yield?