TIM Application

[Mantrid-Drone]

I've been struggling with the application of MX-4 Thermal Compound on my current build (a i3-4340 Dual Core) . I've had to redo the whole thing three times now before I was satisfied that the technique and the amount I was using gave full/correct coverage.

Does anyone here use what I've read is called "tinting" ie. spreading a small amount of TIM all over the CPU and heatsink contact plates then wiping it off with just a tissue/cloth until it appears smooth and clean? The plates afterwards should have a matt rather than shiny surface.

The idea, which has always seemed sensible to me, is that the "tinting" is effectively an undercoat for the main application filling all the microscopic pits in the metal surfaces and the gaps between the pipes in direct contact coolers. In theory this should give a more uniform TIM depth.

I've only done one other build so I was looking around for information about the best way to apply TIM for that at the time and came across this:-

http://archive.benchmarkreviews.com/...1&limitstart=4

The conclusion of the tests shown was that two thin lines of paste approx one third of the width of the CPU plate apart and each line half the length of the CPU plate gave the most even/full coverage. That is the technique I used with a syringe of MX-4 on both my builds but I've found it VERY difficult to get right.

The problem is the width of the line seems to be determined by a combination the nozzle size of the syringe, the pressure used on the plunger, the angle and the speed you draw the lines.

Too many times the line starts fat and ends thin with a fine tail still attached to the nozzle which can and does go anywhere. Using a non-electrically conductive product should be mandatory.

Getting a single even width line with the quite runny MX-4 is difficult enough but two matched lines, correctly positioned really is an utter pain to do. I can well understand those who opt to blob instead.

There is also another question: whether to apply the TIM to the CPU or the heatsink?

Any TIM application advice/comments welcome.

 

[Tweakin]

I've been struggling with the application of MX-4 Thermal Compound on my current build (a i3-4340 Dual Core) . I've had to redo the whole thing three times now before I was satisfied that the technique and the amount I was using gave full/correct coverage.

Does anyone here use what I've read is called "tinting" ie. spreading a small amount of TIM all over the CPU and heatsink contact plates then wiping it off with just a tissue/cloth until it appears smooth and clean? The plates afterwards should have a matt rather than shiny surface.

The idea, which has always seemed sensible to me, is that the "tinting" is effectively an undercoat for the main application filling all the microscopic pits in the metal surfaces and the gaps between the pipes in direct contact coolers. In theory this should give a more uniform TIM depth.

I've only done one other build so I was looking around for information about the best way to apply TIM for that at the time and came across this:-

http://archive.benchmarkreviews.com/...1&limitstart=4

The conclusion of the tests shown was that two thin lines of paste approx one third of the width of the CPU plate apart and each line half the length of the CPU plate gave the most even/full coverage. That is the technique I used with a syringe of MX-4 on both my builds but I've found it VERY difficult to get right.

The problem is the width of the line seems to be determined by a combination the nozzle size of the syringe, the pressure used on the plunger, the angle and the speed you draw the lines.

Too many times the line starts fat and ends thin with a fine tail still attached to the nozzle which can and does go anywhere. Using a non-electrically conductive product should be mandatory.

Getting a single even width line with the quite runny MX-4 is difficult enough but two matched lines, correctly positioned really is an utter pain to do. I can well understand those who opt to blob instead.

There is also another question: whether to apply the TIM to the CPU or the heatsink?

Any TIM application advice/comments welcome.

I put a drop in the middle of the cpu and spread it out with a razor blade...Done. Never had any problems and never tried any other method. Too much work for a 1-3c difference. IMHO

edited due to my stupidity.

 

[IGemini]

People overthink TIM application. The main point I always got from instructions was to cover the area where the core package would be...typically this would be a line for Intel CPUs and a dot for AMD, applied to the CPU. Slightly different approach for coolers with direct copper piping as in the OP article...in this case it's probably easier to apply TIM to the heatsink.

I put a drop in the middle of the cpu and install the heatsink. Then I spread it out with a razor blade...Done. Never had any problems and never tried any other method. Too much work for a 1-3c difference. IMHO

You spread the compound with a blade AFTER installing the heatsink?

I know what you were going for, but in the realm of "wasted work" I'd put spreading there. Seems to me like a holdover of bare Athlon processors using white thermal grease where spreading was required...modern TIM doesn't need that on CPUs with an integrated heatspreader. I've never done it (tried once only to find how utterly wasteful it is of compound and more annoying to clean) and always got pretty low temperatures.

 

[Tweakin]

People overthink TIM application. The main point I always got from instructions was to cover the area where the core package would be...typically this would be a line for Intel CPUs and a dot for AMD, applied to the CPU. Slightly different approach for coolers with direct copper piping as in the OP article...in this case it's probably easier to apply TIM to the heatsink.



You spread the compound with a blade AFTER installing the heatsink?

I know what you were going for, but in the realm of "wasted work" I'd put spreading there. Seems to me like a holdover of bare Athlon processors using white thermal grease where spreading was required...modern TIM doesn't need that on CPUs with an integrated heatspreader. I've never done it (tried once only to find how utterly wasteful it is of compound and more annoying to clean) and always got pretty low temperatures.

I just caught that...edited due to my stupidity. I'm old school and I like to take off as much TIM as I can, hence the once-over with a razor blade. Adds 15 seconds to the operation.

 

[Deders]

I prefer the spread method, especially with MX4 I've found it very effective. But my cooler has direct heatpipes in the IHS.

Bear in mind that despite what Artic say, MX4 will give much better results at least 2 days after the initial application, I would use the PC as normal until then just don't overstress it if your temps are too high.

 

[Mantrid-Drone]

Thanks for the replies and advice, helpful.

No "tinters" here then?

 

[Tristor]

I am not a fan of "tinting". I always start each application with a fresh wipe down of the CPU IHS and the bottom of the heatsink using a lint-free cloth soaked in 91% isopropyl alcohol. I follow it with a wipe down with a dry lint-free cloth, and immediately apply the TIM using the "pea" method followed by mounting the heatsink. When I mount the heatsink I twist it gently while putting even downward pressure on it before securing it.

The only modification to this methodology is when dealing with direct touch heatpipe style heatsinks, in which case I use a a razor blade and spread a small amount of TIM over the base of the heatsink to fill in the gaps between the base and the heatpipes prior to otherwise following the same methodology. This allows me to guarantee that as the heatsink applies pressure that the TIM will spread across the IHS rather than get trapped in those gaps.