New chip startup company Thruchip created from founders in Japan and headed by CEO of Transmeta has TCI (thruchip induction interface) demo method of utilizing a "wireless" type HDSV (high density silicon via) connection that is a lower cost alternative to TSV-wire connections that attach HBM memory to APUs and GPUs.
http://web.stanford.edu/class/ee380/Abstracts/141022-slides.pdf
With Thruchip's lower cost method of attaching little more than a couple tiny smiley sized ^_^ HBM memory to next generation of APU and GPUs, there will be an opportunity to have very high performance mobile and mini desktop systems at a more affordable price.
http://web.stanford.edu/class/ee380/Abstracts/141022-slides.pdf
With Thruchip's lower cost method of attaching little more than a couple tiny smiley sized ^_^ HBM memory to next generation of APU and GPUs, there will be an opportunity to have very high performance mobile and mini desktop systems at a more affordable price.
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