formulavav
The supposition was the that multiplier stayed the same (11.5 x) but the that FSB was increased from 133 (XP) to 166 (XP+). The resulting increase in speed means more work by the processor in a given period of time; more work (cycles, etc) means more heat, unless some physical change occurs in the processor. In the case of the current XP, the processor is a 0.18 micron die versus the newer unreleased XP+, that is a 0.13 micron die. The smaller die should allow the distance, time, work and temperature of the chip to be reduced compared to a similarly clocked XP. Assuming the heat can be effectively removed, then the XP+ might be able to run at a higher FSB (166) than the current XP (133) without any increase in temperature. Now, I am certain that I have violated every rule of Electrical Engineering in the above explanation. But, in general, that is the story.
But, I have received reasonably reliable information that my hope that the XP+ will be released with 166 FSB is not based in fact and is nothing other than my own hope. So, although it would be nice, I must throw cold water onto the thought, and drift back into reality of the chip world where nothing is known for certain until 3 months after a product is released.