So, been thinking about this for a little while. We all know that Intel has been trying to get Atom into phones for a long time. When the silvermont cores first came out they were pretty competitive, though as time has worn on they have dwindled back to being simply mediocre. They need something different, fast, and with a small enough die size to be competitive.
Let's take a look at Core m for example. Now, no, I am not saying they should try to put Core m as it is into phones, there are quite a few reasons why that both wouldn't work, and would go against Intel's current pricing and market segmentation strategy. We all know Intel wants Core m to be THE PREMIUM Ultra-Mobile x86 tablet/pc processor. It arguably is, but well it's way too expensive to go into a phone, I just can't see intel chopping the multi hundred dollar price down to phone SoC level without changing anything else. It also has several things phones don't need (bunch of PCIe, lots of USB ports, etc), and is missing a lot of things they DO need. Also, Core m is not truly a SoC. It requires the companion PCH chip that is on-package. That really won't fly in a phone these days.
So, what I believe they need to do, and frankly I would be surprised if they are not doing this already, is this. Take the Atom SoC, you know with stuff like SDIO, SPI, eMMC, all those other little interfaces you tend to see on ARM SoC's that are heavily used in phones and tablets, but rip out the Atom cores. Take a pair of Skylake cores, take out the ring bus, etc. Take just those 2 cores, and then do a large shared LLC, and pop them in, now bring along enough Gen 9 Intel GPU EU's to be competitive (in both performance and die size) as well. We end up with essentially the un-core of an Atom SoC, which is much more suited to phones than a Core m, along with 2 of the best available x86 cores, a decent enough GPU, and now they need to make sure they either put a modem on die, or if they can't manage that they need to bundle one in for cheap. Not sure how the 14nm process is with that sort of analog stuff, yet.
BOOM we end up with great compute, plenty good graphics, phone/tablet-style connectivity, you know very little SATA/PCIe, only maybe 2-3 USB 3.0 ports, those little interfaces I mentioned above, etc. As it is now the Core m (skylake) die is like 98mm^2 -- I just did some quick poking around, but I can't find the Merrfield or Cherry Trail die sizes. If anyone knows what they are I would love to know. I would think they are in the 60mm^2 range?? But anyways, I think that this new chip would still end up being similar in size to a Core m at <100mm^2 which is definitely in the range of other smartphone chips. They would need to price it at the higher end of the range for mobile SoC's ($40-50, I think, maybe a tad more) but the performance should be there to do it.
Now, that as it is would be a great chip, but what if we wanted something EVEN COOLER
Well, lets see, Intel could take it's older in-order Atom core, modernize it a bit, and put a few of those on the die too. big.LITTLE Intel Style... (Although maybe Intel can get just as much efficiency with Duty Cycling the 'big' SKYL cores)
Come on Intel MAKE IT
We all know that Atom isnt going to win it for ya Intel, you need to step your game UP.
Let's take a look at Core m for example. Now, no, I am not saying they should try to put Core m as it is into phones, there are quite a few reasons why that both wouldn't work, and would go against Intel's current pricing and market segmentation strategy. We all know Intel wants Core m to be THE PREMIUM Ultra-Mobile x86 tablet/pc processor. It arguably is, but well it's way too expensive to go into a phone, I just can't see intel chopping the multi hundred dollar price down to phone SoC level without changing anything else. It also has several things phones don't need (bunch of PCIe, lots of USB ports, etc), and is missing a lot of things they DO need. Also, Core m is not truly a SoC. It requires the companion PCH chip that is on-package. That really won't fly in a phone these days.
So, what I believe they need to do, and frankly I would be surprised if they are not doing this already, is this. Take the Atom SoC, you know with stuff like SDIO, SPI, eMMC, all those other little interfaces you tend to see on ARM SoC's that are heavily used in phones and tablets, but rip out the Atom cores. Take a pair of Skylake cores, take out the ring bus, etc. Take just those 2 cores, and then do a large shared LLC, and pop them in, now bring along enough Gen 9 Intel GPU EU's to be competitive (in both performance and die size) as well. We end up with essentially the un-core of an Atom SoC, which is much more suited to phones than a Core m, along with 2 of the best available x86 cores, a decent enough GPU, and now they need to make sure they either put a modem on die, or if they can't manage that they need to bundle one in for cheap. Not sure how the 14nm process is with that sort of analog stuff, yet.
BOOM we end up with great compute, plenty good graphics, phone/tablet-style connectivity, you know very little SATA/PCIe, only maybe 2-3 USB 3.0 ports, those little interfaces I mentioned above, etc. As it is now the Core m (skylake) die is like 98mm^2 -- I just did some quick poking around, but I can't find the Merrfield or Cherry Trail die sizes. If anyone knows what they are I would love to know. I would think they are in the 60mm^2 range?? But anyways, I think that this new chip would still end up being similar in size to a Core m at <100mm^2 which is definitely in the range of other smartphone chips. They would need to price it at the higher end of the range for mobile SoC's ($40-50, I think, maybe a tad more) but the performance should be there to do it.
Now, that as it is would be a great chip, but what if we wanted something EVEN COOLER
Well, lets see, Intel could take it's older in-order Atom core, modernize it a bit, and put a few of those on the die too. big.LITTLE Intel Style... (Although maybe Intel can get just as much efficiency with Duty Cycling the 'big' SKYL cores)
Come on Intel MAKE IT