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Thermal pad vs. AS 3

F

fibes

Senior member
Which do you recommend on a AMD 64 2800+ 754? The thermal pad would be the easiest way to go, but I believe many of you would go with the A.S. 3 thermal paste because it would be btter for cooling purposes. I myself have never used a thermal pad. I plan to go completely stock with my new build (no ocing). Has anyone used a thermal pad? Are the temps going to be much higher if I use the themal pad vs. the A.S.

Thanks!
 
If you mean for the retail CPU, then just use the thermal pad it comes with. If its for an aftermarket CPU, I personally would go with the AS3 (although AS5 is better and easier to use, so use it if you can get your hands on it).
 
Use what comes on the heat sink, it is high quality and NOT worth switching to AS5 unless overclocking or overheating.

It's Shin-Estu IIRC which is good stuff.
 
AMD's thermal pads are great, but like all thermal pads, you should only use them once. If you ever need to change heatsinks, don't use the pad.

For people that run many tests like Anandtech and overclockers getting the lowest heat they can, and possibly switching heatsinks, use the Arctic Silver, or other such compound.

If you're just a home user or doing some overclocking and you're sure you will stick with the stock HSF, use the pad.

The pad works by melting into the heatsink and processor's tiny grooves in order to maximise thermal contact. IF you change heatsinks, you'll lose that perfect bonding, and placing AS5 on top of the already melted pad won't be ideal. So plan ahead.
 
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