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Thermal pad after phase change?

B

buildingacomputer

Senior member
I am building a computer from Duron 600/EPOX 8KTA+/Taisol HSF. I would like to run it at 600 MHz to make sure I wouldn't have to return any component to the vendor.

If I remove HSF at this point, will the pad material come right off with HSF?
Will some of this stuff stay on the chip and cover L1 bridges?
If all material stays with HSF, can I put HSF right back on ocerclocked Duron?

Thanks for your help.
 
The one downside to PCTC is that its a mess when you remove the HSF. It will only be on the chip and the hsf not on anything else. Taisol sells extra pads for a couple of bucks. If you connect the L1 bridges first, defogger kit is my choice. you'll be OK. Acetone or other cleaners will clean off the bridges if you need to return the chip.
 
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