Originally posted by: Operandi
haha
:thumbsup:Originally posted by: kleinwl
The whole point of a thermal compound is the thermal conductivity. Ie how easily "heat" (thermal energy) "flows" (is transfered) through the material. You add a thermal compound to the top of a cpu to fill in the microscopic voids in the metal to metal contact (cpu to heat exchanger). By doing this, you increase the surface are that the "heat" can "flow" across... thus increasing the thermal efficency (ie. the ability of your heat exchanger to cool the CPU). If you use a poor thermal compound (something that has a lower thermal conductivity) your heat exchanger will be less effective, increasing the temperature of our CPU. In this case, you would be better off with no compound at all.
Actually, the reason for the need to eliminate air pockets is because air has a very low thermal conductivity. If one were to rely on radiation, one would need to leave a complete void between the two surfaces, or at least fill the gap with a material that is transparent to the wavelengths of radiation of interest. Conduction is the only mechanism for heat transfer from core to heat sink.Originally posted by: Zepper
No, thermal compound is mainly to eleiminate dead air pockets between the device and the heatsink. Very little heat is transferred by conduction - almost all is transferred by radiation which dead air tends to block. None of the items listed will hold up under any heat at all. The cheap little tube of white HS grease from RadioSchlock (part no. 276-1372A) would do better than any of those.
. Although someone did do a test with toothpaste (might be dansdata.com) and it did hold up for a while - but toothpaste contains water and glycerine. Water will quickly evaporate from the heat leaving tiny dead-air pockets and glycerine will not hold up to the heat either and will drain to the low side leaving yet more air pockets.
Originally posted by: CycloWizard
Actually, the reason for the need to eliminate air pockets is because air has a very low thermal conductivity. If one were to rely on radiation, one would need to leave a complete void between the two surfaces, or at least fill the gap with a material that is transparent to the wavelengths of radiation of interest. Conduction is the only mechanism for heat transfer from core to heat sink.Originally posted by: Zepper
No, thermal compound is mainly to eleiminate dead air pockets between the device and the heatsink. Very little heat is transferred by conduction - almost all is transferred by radiation which dead air tends to block. None of the items listed will hold up under any heat at all. The cheap little tube of white HS grease from RadioSchlock (part no. 276-1372A) would do better than any of those.
. Although someone did do a test with toothpaste (might be dansdata.com) and it did hold up for a while - but toothpaste contains water and glycerine. Water will quickly evaporate from the heat leaving tiny dead-air pockets and glycerine will not hold up to the heat either and will drain to the low side leaving yet more air pockets.
Ummmmmmmmm... No? Convection is the mechanism of heat transfer driven by bulk motion. In this sense, small air pockets are enclosed, thus must rely on natural (free) convection. Due to the size of the pockets, the thermal gradients within are completely negligible, resulting in no noteworthy free convection.Originally posted by: ericlala
having air = convection
Originally posted by: whatever
Originally posted by: Operandi
haha
huh, i remember seeing something like that where the non-thermal pastes worked decently