wow 12 layers
they look like todays SOIC-W 14 packages
those little hybrid ceramic substrate packages are neat - a die(actual transistor) mounted on a circuit board mounted (ceramic) and wired on a circuit board (fiberglass) mounted on a circuit board (fiberglass)
Rad hard parts are still packaged the same way. I'm not sure I'm interpreting your 12 layer comment properly.....wow 12 layers
they look like todays SOIC-W 14 packages
those little hybrid ceramic substrate packages are neat - a die(actual transistor) mounted on a circuit board mounted (ceramic) and wired on a circuit board (fiberglass) mounted on a circuit board (fiberglass)