INFO: I initially Titled this Post to discuss Thermal Adhesives & Pastes related to attaching Heatsinks specifically to the Video Cards VRM modules when installing aftermarket Hi-End Air Coolers; however, with the participation of some very interested and informative members the thread has taken a light of it's own and should be appropriately Titled : "The Arctic Accelero R9 290X-Xtreme III"
The only thing I ask is that contributing Members keep the Red Vs Green Rivalry to a Minimum Taunt and focus on finding a more efficient method to mount the Arctic Accelero Xtreme III on the Reference R9 290/X Cards or for a nVidia card for that matter but it is general conses that the latest AMD cards would benefit more from a better Air Cooler.
I'm sure this thread will be very useful to others wanting to try something different and keep our interests active.
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I just bought a Gigabyte Ref R9 290X and the Arctic Accelero Extreme III cooler.
From what I've read the Heat Sink Adhesive in the Accelero Extreme III Kit is no good.
A side from using Thermal Tape such as 3M™ Thermally Conductive Adhesive Transfer Tapes 8805 5ml (0.125mm thick) where tape may not be a suitable solution, I've read that Arctic Silver Premium Silver Thermal Adhesive (None Electrical Conductive) is the Best; BUT, its Epoxy and once applied it's on there forever and one cannot remove the Heat Sinks without damaging the chips.
I've also read that if one mixes a 1:1 Ratio of Arctic Silver Premium Silver Thermal Adhesive with Arctic Silver Alumina Premium Ceramic Polysynthetic Thermal Compound (Also None Electrical Conductive), one can remove the Heat Sinks if you place the Card in a Freezer for 30 mins, the Adhesive Epoxy mix crystalizes and you can pry off the Heat Sinks. I do not know what mess is left though. I am willing to experiment with this method on some old cards.
Another credited Thermal Adhesive that remains Flexible and Heat Sinks can be removed is FUJIK Thermal Glue, Silicone (50ml Grease Like). Apparently not as efficient as Arctic Silver's Solution but you can remove Heat Sinks without Damaging chips.
As you see I do not want to permanently mount the Heat Sinks of the Accelero Extreme III Kit but I do want Good Adhesion with Descent Heat Transfer where the Heat Sinks can be removed with out damaging the chips: That is, I want to be able to return the Card back to it's Original Ref Cooler Design if need be.
Right now I am leaning toward the FIJIK Thermal Glue solution but have no idea how dependable the product is at preserving Thermal Efficiency or its ability to keep the Heat Sink on the chip.
I would appreciate anyone with experience in this matter to please provide some In-Put as I do need advice.
Thanks: Ron
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i7 2700k/ASUS P8Z68-V Pro Gen3/Corsair H110 AIO (running @ .996v/1600Mhz to 1.376v/4600Mhz 24/7 between 36 to 67C), 4 x's 4GB sticks of Samsung MV-3V4G3D-US DDR3 running at 1.34v/1866Mhz 9-9-9-24 1T with 4GB's assigned to a RAMDisk drive to handle Win7 64 Bit Sluff and negate writes to the SSD, Samsung 840 Pro 256 SSD, 2 x's WD5001AALS HDD's in Raid-0, 1 x's WD1002FAEX 1TB, ASUS DRW-24B1ST DVDRW, Hauppauge WinTV HVR-1250 PCIe, 2nd Intel NIC for Dual Networking, XFX 850W Pro Black Black Edition modular PSU, AMD Ref Gigabyte 1000Mhz R9 290X/Accelero Xtreme III, eVGA GTX 280 in reserve for Physic's-X support, Fractal Design ARC Midi R2 case, QX2510 Samsung PLS 2560x1440 res display at 120Hz.
TOTAL Investment on this Platform including 13% HST Tax Plus Shipping is approx $2,534.00 spent over a period of a year.
Aside from Mfgr's 10 to 15% price markup selling to the CDN Market the killer is the 13% HST Tax and cost of shipping in Canada. I pd $3000 for a 386-40 DX in 1994 - LOL.
The only thing I ask is that contributing Members keep the Red Vs Green Rivalry to a Minimum Taunt and focus on finding a more efficient method to mount the Arctic Accelero Xtreme III on the Reference R9 290/X Cards or for a nVidia card for that matter but it is general conses that the latest AMD cards would benefit more from a better Air Cooler.
I'm sure this thread will be very useful to others wanting to try something different and keep our interests active.
----------------------------------------------------------------------------------------------------------------
I just bought a Gigabyte Ref R9 290X and the Arctic Accelero Extreme III cooler.
From what I've read the Heat Sink Adhesive in the Accelero Extreme III Kit is no good.
A side from using Thermal Tape such as 3M™ Thermally Conductive Adhesive Transfer Tapes 8805 5ml (0.125mm thick) where tape may not be a suitable solution, I've read that Arctic Silver Premium Silver Thermal Adhesive (None Electrical Conductive) is the Best; BUT, its Epoxy and once applied it's on there forever and one cannot remove the Heat Sinks without damaging the chips.
I've also read that if one mixes a 1:1 Ratio of Arctic Silver Premium Silver Thermal Adhesive with Arctic Silver Alumina Premium Ceramic Polysynthetic Thermal Compound (Also None Electrical Conductive), one can remove the Heat Sinks if you place the Card in a Freezer for 30 mins, the Adhesive Epoxy mix crystalizes and you can pry off the Heat Sinks. I do not know what mess is left though. I am willing to experiment with this method on some old cards.
Another credited Thermal Adhesive that remains Flexible and Heat Sinks can be removed is FUJIK Thermal Glue, Silicone (50ml Grease Like). Apparently not as efficient as Arctic Silver's Solution but you can remove Heat Sinks without Damaging chips.
As you see I do not want to permanently mount the Heat Sinks of the Accelero Extreme III Kit but I do want Good Adhesion with Descent Heat Transfer where the Heat Sinks can be removed with out damaging the chips: That is, I want to be able to return the Card back to it's Original Ref Cooler Design if need be.
Right now I am leaning toward the FIJIK Thermal Glue solution but have no idea how dependable the product is at preserving Thermal Efficiency or its ability to keep the Heat Sink on the chip.
I would appreciate anyone with experience in this matter to please provide some In-Put as I do need advice.
Thanks: Ron
----------------------------------------
i7 2700k/ASUS P8Z68-V Pro Gen3/Corsair H110 AIO (running @ .996v/1600Mhz to 1.376v/4600Mhz 24/7 between 36 to 67C), 4 x's 4GB sticks of Samsung MV-3V4G3D-US DDR3 running at 1.34v/1866Mhz 9-9-9-24 1T with 4GB's assigned to a RAMDisk drive to handle Win7 64 Bit Sluff and negate writes to the SSD, Samsung 840 Pro 256 SSD, 2 x's WD5001AALS HDD's in Raid-0, 1 x's WD1002FAEX 1TB, ASUS DRW-24B1ST DVDRW, Hauppauge WinTV HVR-1250 PCIe, 2nd Intel NIC for Dual Networking, XFX 850W Pro Black Black Edition modular PSU, AMD Ref Gigabyte 1000Mhz R9 290X/Accelero Xtreme III, eVGA GTX 280 in reserve for Physic's-X support, Fractal Design ARC Midi R2 case, QX2510 Samsung PLS 2560x1440 res display at 120Hz.
TOTAL Investment on this Platform including 13% HST Tax Plus Shipping is approx $2,534.00 spent over a period of a year.
Aside from Mfgr's 10 to 15% price markup selling to the CDN Market the killer is the 13% HST Tax and cost of shipping in Canada. I pd $3000 for a 386-40 DX in 1994 - LOL.
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