Vesku
Diamond Member
- Aug 25, 2005
- 3,743
- 28
- 86
Having a process ready and first product in retail doesn't go together every time. Intel manages to do it at the same time because they are both the Fab manufacturer and the retail product designer.
Also, GloFo had 32nm process and products in retail before TSMCs 28nm. GloFos 28nm is a half node of 32nm when TSMC 28nm is a full node over 40nm.
Comparing time-line of products in retail doesnt show when each process was ready.
Sure, it was "ready" but despite GF basically begging non-AMD clientele to use their foundry it took over a year to pump out the first product. Yes, that's exactly how it went down. Reality check. It doesn't seem very likely, timeline suggests there were yield issues well after GF's claim of being ready. We are talking about an industry that routinely claims their nodes are farther along then they are by simply ignoring the yield aspect:
"GLOBALFOUNDRIES: Ready for 20nm semiconductor designs" 8/30/2011
http://electroiq.com/blog/2011/08/globalfoundries-ready-for-20nm-semiconductor-designs/
"Two flavors of GF 20nm, one for 2013 rollout one for 2014 rollout" 8/30/2011
http://www.brightsideofnews.com/news/2011/8/30/globalfoundries-announces-20nm-process-no-to-soi.aspx
"ARM, TSMC tape-out 20-nm processor" 10/18/2011
http://www.eetimes.com/document.asp?doc_id=1260423
If we go by foundry PR then we should be swimming in 20nm chips.
