Intel Developer Forum (IDF) is scheduled to be held next week, where some manufacturers will present their own hardware using USB 3.0 technology.
The next-generation USB 3.0 (SuperSpeed USB) boosts the data transfer rate 10 times over current technology, while also improving power efficiency.
Point Grey Research will roll out a prototype high-performance digital video camera that integrates a 3-megapixel Sony ?IMX036? CMOS (complementary metal-oxide-semiconductor) image sensor to output 1080p high-definition images at 60 frames per second. Fujitsu will bring its laptop which features an NEC Electronics ?host controller? chip that will exchange data with an external SuperSpeed USB drive from Buffalo Technology.
Asus will also show off their X58 motherboard with SuperSpeed USB which employs the same NEC chip, and exchange data with a LucidPort SuperSpeed USB mass storage device running the new USB Attached SCSI Protocol (UASP), delivering improved performance and reduced latency.
Developed by Intel, HP, Microsoft, NEC, ST-Ericsson and Texas Intruments, the USB 3.0 is expected to be officially introduced in consumer electronics products in late 2009 or early 2010
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