But we can go ahead and confirm it again
View attachment 55991
But perhaps I can depict it in a more pictorial way
View attachment 55994
L3 being same, even though huge, would really drive up the Xtor count everywhere else.
One thing you will notice is that the die size increase from Zen 2 to Zen 3 is actually less than 8% if we discard the 4x long strips of silicon area allocated to TSVs.
The increased size was in the FPU
due to native AVX256 support
and a small bump in L2.
Core itself did not increase much overall (AMD did cut the BTB size in Zen 3 a bit vs Zen2)
Worst case 90MTr/mm2 is basically crappy density from a process targeting 191 MTr/mm2 (Apple got 134 MTr/mm2 from N5, and 82 MTr/mm2 from N7)
Zen2 and Zen3 data from Wikichip/Die shots