- Feb 22, 2007
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Cool breakthrough by Carnegie Mellon University. They have managed to create magnetic nano structures , tiny particles in the solder that when hit with a 280Khz magnetic field heat and melt forming the solder connection. So you could apply it to a board and parts and use a magnetic field to only heat the solder and not the parts , not having to heat the board in ovens like now . It takes it about 45 seconds to do the reflow.
This could be HUGE. It gets rid of the heat issues and also the possibility of bad connections from improper heating and cooling in the standard methods. If I could afford it I would be buying stock in this process
http://wms.andrew.cmu.edu:81/nmvideo/CIT_MSE_11-12-09.mov
This could be HUGE. It gets rid of the heat issues and also the possibility of bad connections from improper heating and cooling in the standard methods. If I could afford it I would be buying stock in this process
http://wms.andrew.cmu.edu:81/nmvideo/CIT_MSE_11-12-09.mov