- Dec 22, 2000
- 5
- 0
- 0
I set up a super system...
Check Sig
anyhow..
could over clock this sucker nicely by fsb.. 110..processor at 1223, memory bus at 150!.. was Great!!! Then I decited to back off the fsb and do multiplyer overclocking so I did pencil trick.. set fsb back to 100. wouldn't over clock to 11.5x 100 = 1150???. errors and such on bootup(duel boot 98 and 2000).
When i went back in to redo the pencil trick.. oh.. using a globle win 38.. what else.heh. Noticed that some of the goop(the melted pad that came on it) was not between heatsink and processor but around the edge of processor. I cleaned it up and took a look at heat sink.. plenty of thermal gum left..
As i understand it you want a VERY thin layer between the processor and heat sink.. just enough to fill in the inperfections of the heatsink..
I clamped it back down on the m/board.. all ran fine.. like it did.. same overclocking abilitys. After a day I had a few lockups in a game or two and also just browsing the web in both opperation systems.. I figure time to clean off the pencil trick and forget about it. So off came the heat sink... what i saw pissed me off to no end.
It seams the residue of the thermal coumpount that spilled off the edge of the processor actually BURNED my chip! No wonder it was messing up! anyhow. .cleaned it up the best I could put the heatsink back on with like NO goop on it.. very little... reboot.. toast...yup I smell bad cookin
The moral of this story is.... DOn't use that stupid pad/goop.. if the compound get's off that chip the heat will transfer onto the wafer and burn the sucker
Am I am a wacko or the globle win38 has too much of goop it??
Anyone else have simular problems???
(Edit) spoke with vendor and it seams that it wasn't a pad really at all. It was more or less a square of some thermal substance that can conduct Electricity!. Be carefull with the stuff on that Globle 38. It isn't the first time this has happened. If you have a pinkish goo take some off!
Check Sig
anyhow..
could over clock this sucker nicely by fsb.. 110..processor at 1223, memory bus at 150!.. was Great!!! Then I decited to back off the fsb and do multiplyer overclocking so I did pencil trick.. set fsb back to 100. wouldn't over clock to 11.5x 100 = 1150???. errors and such on bootup(duel boot 98 and 2000).
When i went back in to redo the pencil trick.. oh.. using a globle win 38.. what else.heh. Noticed that some of the goop(the melted pad that came on it) was not between heatsink and processor but around the edge of processor. I cleaned it up and took a look at heat sink.. plenty of thermal gum left..
As i understand it you want a VERY thin layer between the processor and heat sink.. just enough to fill in the inperfections of the heatsink..
I clamped it back down on the m/board.. all ran fine.. like it did.. same overclocking abilitys. After a day I had a few lockups in a game or two and also just browsing the web in both opperation systems.. I figure time to clean off the pencil trick and forget about it. So off came the heat sink... what i saw pissed me off to no end.
It seams the residue of the thermal coumpount that spilled off the edge of the processor actually BURNED my chip! No wonder it was messing up! anyhow. .cleaned it up the best I could put the heatsink back on with like NO goop on it.. very little... reboot.. toast...yup I smell bad cookin
The moral of this story is.... DOn't use that stupid pad/goop.. if the compound get's off that chip the heat will transfer onto the wafer and burn the sucker
Am I am a wacko or the globle win38 has too much of goop it??
Anyone else have simular problems???
(Edit) spoke with vendor and it seams that it wasn't a pad really at all. It was more or less a square of some thermal substance that can conduct Electricity!. Be carefull with the stuff on that Globle 38. It isn't the first time this has happened. If you have a pinkish goo take some off!