Okay it sounds like people like me were reading the previous quote incorrectly.
It looks like he is saying that the FIVR is in the tablet soc's, but not in the desktop CPU's.
I thought FIVR was supposed to increase energy efficiency? So why did they have to remove it for the most TDP-constrained products?
Or does it have to do with thermal density?
Which HOL are you referring to?Yep. No Skylake refresh, but Kabylake is a 14nm successor to Skylake and will precede 10nm Cannonlake. Nothing got cancelled, Kabylake got added and everything in the pipe after kabylake got pushed out 1 year because 10nm HOL is pretty bad.
Skylake->Kabylake->Cannonlake->icelake
Weird, how we only got 2 bridges and 2 wells, but 4 lakes. LOL
4 lakes suggest that they are all based on the same architecture.
32nm Tock-Sandy Bridge
22nm Tick-Ivy Bridge
22nm Tock-Haswell
14nm Tick-Broadwell
14nm Tock- Skylake Late 2015
14nm Tick-Kabylake Late 2016
10nm Tick-Cannonlake Late 2017
10nm Tick-Icelake Late 2018
10nm Tock-? Late 2019
7nm Tick-? Late 2020
That makes it 3 generations per process from now on. Rejoice for 3-5% improvement per year! If that can even be maintained. In a few years I reckon that 3-5% improvement will be in the U and Y chips and it'll be the "IoT" chips that gain 30-40% per gen.
It's notable that now Ticks don't imply any die shrink. But why do you think that Icelake won't be a Tock?
I think his logic is simply based on the name. Same name, same basic uArch/Tock. eg. SandyBridge and IvyBridge, Haswell and Broadwell and now 4 chips ending with lake.