I have been reading quite a few articles about the Shin-Etsu thermal compound and the ThermalRight SLK-900U. Thought I would see for myself if these could do better than my Alpha 8942 with ASIII. I had my doubts but not now.
Is it worth changing thermal compounds and/or heatsinks???
Opinions vary ? Up to you.
First: A couple of points about this Shin-Etsu thermal compound. It is extremely thick and can be difficult to spread. It has a tendency to glob or roll up. I used a plastic baggy to apply it and finally just applied quite a bit more than I have ever used with AS. I massaged it over the die until it was finally completely covered and then used my credit card laying very flat to progressively smooth and remove the excess thermal compound that was on the die. Actually wiped off the credit card several times to remove the excess.
Second: the SLK-900U has a base that does not cover the entire die of the P4, which concerned me at first. Using a 92mm fan also hangs over the side of the heatsink. I used the screw mount that comes with the sink similar to the 8942, which uses the spring screws for pressure.
This is the improvement I experienced
I was using a 80mm 50cfm Sunon on the Alpha and a 92mm 57cfm Panaflo on the 900U. So these were pretty close but not exactly the same.
Shin-Etsu thermal compound vs. AS3 reduced temps on the Alpha 8942 by
3C idle and 5C load.
SLK-900U vs. Alpha 8942 reduced temps by another
2C idle and 3C load.
Totally my temps have now dropped 5C idle and 8C load.
It did take 4 days to see the best performance improvement with the Shin-Etsu, as the first day or two it was almost the same as the AS3.
I used MBM and Asus Probe to check these temps so the comparison would be relative with the monitors used.
I was getting 47C idle and 61c load (3 hours Prime95)
Now I have been consistently running at 42C idle and 53C load.
Is it worth changing thermal compounds and/or heatsinks???
Opinions vary ? Up to you.
First: A couple of points about this Shin-Etsu thermal compound. It is extremely thick and can be difficult to spread. It has a tendency to glob or roll up. I used a plastic baggy to apply it and finally just applied quite a bit more than I have ever used with AS. I massaged it over the die until it was finally completely covered and then used my credit card laying very flat to progressively smooth and remove the excess thermal compound that was on the die. Actually wiped off the credit card several times to remove the excess.
Second: the SLK-900U has a base that does not cover the entire die of the P4, which concerned me at first. Using a 92mm fan also hangs over the side of the heatsink. I used the screw mount that comes with the sink similar to the 8942, which uses the spring screws for pressure.
This is the improvement I experienced
I was using a 80mm 50cfm Sunon on the Alpha and a 92mm 57cfm Panaflo on the 900U. So these were pretty close but not exactly the same.
Shin-Etsu thermal compound vs. AS3 reduced temps on the Alpha 8942 by
3C idle and 5C load.
SLK-900U vs. Alpha 8942 reduced temps by another
2C idle and 3C load.
Totally my temps have now dropped 5C idle and 8C load.
It did take 4 days to see the best performance improvement with the Shin-Etsu, as the first day or two it was almost the same as the AS3.
I used MBM and Asus Probe to check these temps so the comparison would be relative with the monitors used.
I was getting 47C idle and 61c load (3 hours Prime95)
Now I have been consistently running at 42C idle and 53C load.