Semiconductor Manufacturing Details

[lexxmac]

I'd like to know if anyone knows of some sites that have DETAILED information on how ICs are actually produced. Specifically, I'm looking for how the individual chips are cut out of the wafer, how those extremely thin wires on the inside of the packaging are connected to the die itself, and any information on how BGA packaging goes together. I know this may not be "highly technical" but I figured the people who would know might be hanging around in here. This is not for a project or research paper, but out of curiosity. Thanks. (Moderator, feel free to lock this if I have misplaced this thread)

 

[f95toli]

Why not buy a book? I doubt you will be able to find sites with that type of information, for the simple reason that you need to cover a LOT off information.
Most technical universities have course in microelectronic fabrication, try looking at their web-sites. I know of one book which is used in courses like that: Rao Tummala "Fundamentals of Microsystems Packaging"

 

[lexxmac]

At the moment, I don't have the money to buy a book like that. Those kind of books are usually in excess of $50 and that is just too much for me to spend to satisfy my curiosity.

 

[akihabara]

Hi, I am new here.

I also would like to know it!! I tried searching for a site that gives a overview (which i can understand) but in vain.
I guess there is less information about packaging technology than wafer process for outsiders.I wonder it's all know-how matter?

I feel it's no help listing these but I have spent a lot of time. I dare to in vexation. Sorry in advance.

Chapter E: Ball Grid Array Technology
http://extra.ivf.se/ngl/E-BGA/ChapterE1.htm

The Reliability Analysis and Structure Design for the Fine Pitch Flip Chip BGA Packaging
http://my.nthu.edu.tw/~rdwww/abroad/8-2.pdf

A Survey of Compliant Interconnects for Wafer Level Packaging
http://peter.wreck.org/reports/ECE8803/slides.pdf

IC Packaging Technology and Forecast
Bogatin Enterprises, LLC
http://www.ericbogatin.com/TechnicalFeaturesArticles/Status 991228.pdf

Challenges in Bare Die Mounting
http://www.dieproducts.org/pdf/bare_die_mounting.pdf

Packaging Trends - Portable Applications
http://www.reed-electronics.com/sem...00&articleid=CA295354&nid=2301&rid=1130820508

An innovative approach to wafer-level MEMS packaging
http://sst.pennnet.com/Articles/Art...Articles&Subsection=Display&Article_ID=133164

Advanced Packaging
http://ap.pennnet.com/home.cfm

Semiconductor ITNERNATIONAL Semiconductor Packaging
http://www.reed-electronics.com/semiconductor/community/3026/Semiconductor+Packaging

SECAP
http://www.secap.org/technology.php

 

[Eskimo]

Originally posted by: lexxmac
I'd like to know if anyone knows of some sites that have DETAILED information on how ICs are actually produced.

There aren't really those types of sites out there. If you can't afford a book try going to your local library, it's free. If your public library doesn't have any books on the subject find a friend who can take you to a university library, heck if all you want to do is read the books in the library you don't even have to really be a student. Or you could do a bit of reading for free in your local B&N or Borders.

Specifically, I'm looking for how the individual chips are cut out of the wafer

With a high speed inner diameter diamond saw blade. Check out www.kns.com, they manufacture a large % of the dicing systems in use and have a small technical library. Actually you can find some useful albeit slanted information at many vendor's websites. Nothing in depth though, they are trying to sell you their systems, not the expertise.

how those extremely thin wires on the inside of the packaging are connected to the die itself
, and any information on how BGA packaging goes together.

K&S (linked previously) and esec.com both make bonders. There are other companies i'm less familiar with.

I hope that helps. Backend packaging is not my forte but if you ever have any questions about actual fabrication of ICs at the wafer level i'd be happy to answer as best I can.

 

[f95toli]

Eskimo: You seem to have more knowledge about this than I do. Are dicers (rotating diamond-saw) used even in large scale production?
I use a dicer occascionaly but the one we have in our cleanroom is fairly slow, I don¨t think it would be very practical in a production-line.

 

[Eskimo]

With the products i'm familiar with yes. I'm not sure what the cutting edge uses but I know there is a large push to move to laser based systems. As process rules continue to shrink the size of the chips the 'streets' between the die take up a larger area as a % of the total silicon area. The streets will always be necessary for off die parametric testing devices and metrology sites but it would be nice to be able to safely squeeze them closer.