Heatpipes return the liquid by either gravity or capillary force, and it is clearly the latter in the Vapor-X, so direction should not matter.Vapor-X heat transfer model
Vapor Chamber Technology is based on the same principles as heatpipe technology. A liquid coolant is vaporised at a hot surface, the resulting vapor is condensed at a cold surface then the liquid is returned to the hot surface. The recirculation process is controlled by a wick system.
I think there was a thread on that in the Cases and Cooling forum. It is not a good idea, the liquid is there for a reason.Has anyone ever punctured a vapor chamber, to release the liquid just to see how it would work as a dry heatsink? I wonder what amount the liquid contributes, seeing how copper is very good at conducting heat already, surely it can't be too much worse?