Question SAMSUNG develops GDDR6W memory with doubled capacity and performance


Diamond Member
Dec 17, 2004
according to their marketing blurb...

Developing ‘GDDR6W’ Graphics Memory, with Doubled Capacity and Performance Based on the Cutting-edge Fan-Out Wafer-Level Packaging (FOWLP) Technology

High performance, high capacity and high bandwidth memory solutions are helping bring the virtual realm to a closer match with reality. To meet this growing market demand, Samsung Electronics has developed GDDR6W (x64): the industry’s first next-generation graphics DRAM technology.

GDDR6W builds on Samsung’s GDDR6 (x32) products by introducing a Fan-Out Wafer-Level Packaging (FOWLP) technology, drastically increasing memory bandwidth and capacity.

Since its launch, GDDR6 has already seen significant improvements. Last July, Samsung developed a 24Gbps GDDR6 memory, the industry’s fastest graphics DRAM. GDDR6W doubles that bandwidth (performance) and capacity while remaining the identical size of GDDR6. Thanks to the unchanged footprint, new memory chips can easily be put into the same production processes customers have used for GDDR6, with the use of the FOWLP construction and stacking technology, cutting manufacturing time and costs...



Diamond Member
Apr 25, 2015
It almost looks like it was developed specifically for integrating on CPU/SOC/APU packages.

64 bit per chip, 4 GB of RAM per chip, 192 GB/s bandwidth with 24 Gbps 64 bit chip, 384 GB/s with 128 bit, 24 Gbps chips. The only problem: 8 GB system RAM in such combo.