Taken from EE times:
4GB NAND flash features:
73nm word-line (control gate) half pitch
54nm space between floating gates
90nm control gate
90nm bit line contacts
in a tungsten silicide over polysilicon.
However Toshiba's 90nm MLC FLASH
has a 138mm die (vs. Samsung's 156nm) for 4GB
50ns serial accesstime min (vs. Samsung's 25ns)
600us page pgm (vs. samsungs's 200us)
2ms block erase (vs. samsung's 1.5ms).
4GB NAND flash features:
73nm word-line (control gate) half pitch
54nm space between floating gates
90nm control gate
90nm bit line contacts
in a tungsten silicide over polysilicon.
However Toshiba's 90nm MLC FLASH
has a 138mm die (vs. Samsung's 156nm) for 4GB
50ns serial accesstime min (vs. Samsung's 25ns)
600us page pgm (vs. samsungs's 200us)
2ms block erase (vs. samsung's 1.5ms).