I will tell you this much: At voltages below 1.35v, Ryzen produces very little heat. If you can be happy at clockspeeds of 3.8 GHz and lower, you probably do not need that much cooling.
Above 1.35v things get intense.
Also, I have noticed that there is a very big difference between keeping Tctl down and keeping CPU/socket temp low. It's easier to cool the IHS than it is the die. Check out this screenshot I took of data gathered during a y-cruncher run:
https://www.dropbox.com/s/pt9id67e6e7fpa2/ycrunch.png?dl=0
As you can see, the max CPU/socket temp was 45C. Even with -20C to account for the offset, Tctl still hit 68.1C. That's a ~23C difference in temp between the die and the IHS/socket.
Does anyone have a ballpark figure for the average bondline thickness of indium solder used between integrated heatspreaders and CPU dice?