Results
I ran into a lot of troubles, setbacks, and moments of desparation (which I didn't expect to in the first place) but I finally got my card back together and working with OCZ Freeze and a bit of Thermalright Chill Factor 2 (ran outta the freeze). Pre-tim temps, 104/105, After - 91/92. Also the fps in OCCT didn't drop, as they did at 104-105c prior.
Here are the problems I ran into, and how I fixed them:
1.
difficult screw to unscrew on gpu cover shroud under sticker. might not be a problem for you guys, I couldn't get one screw out, had to use a drill to drill into it and just take it out, not reusable.
2.
Sli cable keeps unhooking when assembling card. Its barely long enough to connect both cards, and they aren't held in place by much. Once you connect both notches on the second card, you have to be super careful with it. You have to bend the backplate a lot to get the top card free from the heatsink, like "where's the vise" kind of bending just about. You have to bend it even more to put the card together without disturbing the very delicate Sli cable. I bent the backplate on a hard desk after removing it from the card. This took it out of the equation when trying to delicately put the sandwich back together without knocking out the Sli cable. Afterward, put a few screws in before bending the backplate back over the dpi ports and screwing it back in. The sli cable, and thus the pcb board, really needs to take priority.
Tips
a
When putting it back together, just throw 4 screws in each card at the corners, and give it a test run to make sure the sli cable is intact and the card's blue led lights up
b
Guide says to keep the screws separate from top and bottom. Not much need, they are the same either way. You got the spring screws, small silver screws, and small black screws. Equal number each side in the same places. After putting it together like 3-4 times you get a good feel for it.
c
Having experience with only cpu's for applying TIM, my initial technique wasn't great. After rebuilding the card 3-4 times I was able to see the pattern of the TIM on the chipset, and basically the corners weren't getting the TIM when using a crossfire design, one vertical/horizontal line in the middle, about 1/3 total diameter. After applying a small drop near the corners and rebuilding it again, it was fully covered much more nicely.
d
Guide mentions the thermal paste holds the card together like glue. Think SUPERglue, you really gotta pull at the middle, very hard. Just don't pull at the sides and snap the card, cus that'd suck.