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Ram Sinks or Heat Spreaders?

DaSuperchargedChef

Junior Member
Newbie question here. I'm working on case air flow dynamics and am wondering which option is more efficient. I realize that the heat spreaders cover both sides of the ram but would ram-sinks do a better job of getting rid of the heat? I'm working on some baffles inside my case to run air right past the ram so I need to figure out which would be the best method to dissipate the heat.
 
ramsinks work better for airflow IMO. if your mobo has 3 memory slots and you are only using two, plug in the sticks in the two outer slots. that way you can fit ramsinks on both sides
 
Yes I am overclocking 🙂

Between the GPU and CPU I'm trying to get as much out of the system as possible before I add my watercooling setup. So sinks then?
 
Originally posted by: glorygunk
Originally posted by: sodcha0s
Sinks, but I don't think they are neccessary.


we don't know if he's overclocking his FSB, in which case it would be necessary


Really? Hmmm.... I overclock my FSB just fine without them. Honestly, your CPU would fail way before your ram would, assuming you're using quality ram.
 
I'm just wondering which is more efficient provided that I have adequate air flow across the ram. I would guess the sinks would cool better just because of their ability to disperse heat through the fins, where a spreader is smooth so it doesn't seem like much heat would transfer. Is there any way to actually test it?
 
The sinks will have more surface area, and also extent away from the chips allowing heat to flow away from the modules. Heatsinks are definitely more efficient.
 
Originally posted by: DaSuperchargedChef
I'm just wondering which is more efficient provided that I have adequate air flow across the ram. I would guess the sinks would cool better just because of their ability to disperse heat through the fins, where a spreader is smooth so it doesn't seem like much heat would transfer. Is there any way to actually test it?
I'm not familiar with either, but I do know a lot about fluid dynamics and heat transfer... You're saying that RAMsinks create a smooth surface on both sides of the chips and the heat sink is a larger fin? Unless the heat sink has considerably more surface area than both faces of the RAMsink combined, the RAMsinks will be more efficient. I can explain why if you'd like, and I could tell you for sure if you posted some pics of what you're talking about. 😀
 
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