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RAM sinks: adhesive thermal tape or AS epoxy?

T

tcsenter

Lifer
I want to put RAM sinks on a video card. I have some Arctic Silver Epoxy, but am not sure if I should proceed with this permanent solution. The permanence of it doesn't concern me as much as the long-term efficacy.

It seems counter-intuitive to me that cured epoxy would be a better thermal interface than adhesive thermal tape. Should I go with the Arctic Silver Epoxy or stick with the adhesive thermal tape that comes pre-applied to the RAM sinks?
 
I'd mix the AS epoxy with some regular thermal paste (about half and half) so it doesn't cure like cement and you'll be able to remove the heatsinks if you ever want to.
 
Don't believe him TC I tore up a $300 video card this way, with that mixture in fact. Tore all my memory right off the card. Well live and learn...don't do it the hardway like me.. Use tape.
 
Originally posted by: Zebo
Don't believe him TC I tore up a $300 video card this way, with that mixture in fact. Tore all my memory right off the card. Well live and learn...don't do it the hardway like me.. Use tape.
Click to expand...

Crap, you scared me. I remembered I recommended the AS5/epoxy mix to you awhile back and thought you were going to be coming after me. :Q

I've never had a problem with that, mostly because I use the "Heat Method" - fire the thing up, run it through a few 3DMock loops or just game, then dental-floss your way through the goop. It worked for me, but I guess sometimes "sh!t happens" unfortunately. 🙁 Sorry to hear about the card.

- M4H
 
Um, guys, I think you're delving off-topic a bit.

The permanence of it doesn't concern me as much as the long-term efficacy.
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The OP is looking for the long term heat transfer ability of thermal tape vs thermal epoxy, not removeability. Arctic Silver Epoxy II has a heat conductivity greater than that of frag tape which, AFAIK, does not degrade over time.
 
As long as it works, I'm not concerned about the bond permanence. I've seen cured epoxy shrink and become brittle when exposed to heat (50C~60C) over just a few months time.

Has anyone tried the 'corner' method where conventional paste like AS5 is used on the majority of the surface but each corner is cleaned off then dabbed with epoxy?
 
Originally posted by: tcsenter
As long as it works, I'm not concerned about the bond permanence. I've seen cured epoxy shrink and become brittle when exposed to heat (50C~60C) over just a few months time.

Has anyone tried the 'corner' method where conventional paste like AS5 is used on the majority of the surface but each corner is cleaned off then dabbed with epoxy?
Click to expand...

I used to use that method. I would put a "stripe" of AS3 down the center of the mem chip, then a very tiny dab of super-glue on two opposing corners only of the mem chip. Alway's seemed to be pretty easy to remove.

Good quality frag tape work's good, but as far as actuall cooling, thermal compound works better, be it AS epoxy or some sort of AS3 method.

 
Originally posted by: tcsenter
As long as it works, I'm not concerned about the bond permanence. I've seen cured epoxy shrink and become brittle when exposed to heat (50C~60C) over just a few months time.

Has anyone tried the 'corner' method where conventional paste like AS5 is used on the majority of the surface but each corner is cleaned off then dabbed with epoxy?
Click to expand...



I've used the "corner" method with Arctic Silver as the thermal compound, but the usual method of securing it is to use plain old superglue in the corners.
 
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