I installed a Sunbeam Core Contact Freezer last night - first off it's an odd little beast, feels flimsy yet efficient. My biggest question is with the thermal compound... I've read several posts and articles on it, but in the end what I ended up doing is using AS5 and spreading a layer on the CPU, then mounting the HSF.
I'm currently getting 29C idle and 39C load (Prime95) on a Phenom II 940 @ Stock (3.0GHz @ 1.35v) with the side panel off - since I'm not finished installing/routing cables/etc.
I'm wondering if that sounds right, considering I used probably about 4 times as much AS5 as I normally do. I'd guess maybe 1/4 to 1/3 of what I applied ended up on the edge of the card that I spread it with - but does this sound right for a cooler like this? I can't help but feel that I'm using too much AS5 for some reason. I haven't done the "spread the compound" thing on a CPU since the exposed-core Athlon XP days.
Of course after reading the reviews, I'm wondering if I should have used the TX-2 that came with the cooler.
I'm currently getting 29C idle and 39C load (Prime95) on a Phenom II 940 @ Stock (3.0GHz @ 1.35v) with the side panel off - since I'm not finished installing/routing cables/etc.
I'm wondering if that sounds right, considering I used probably about 4 times as much AS5 as I normally do. I'd guess maybe 1/4 to 1/3 of what I applied ended up on the edge of the card that I spread it with - but does this sound right for a cooler like this? I can't help but feel that I'm using too much AS5 for some reason. I haven't done the "spread the compound" thing on a CPU since the exposed-core Athlon XP days.
Of course after reading the reviews, I'm wondering if I should have used the TX-2 that came with the cooler.
