Question about actual socket 1366 mechanism

[aamsel]

Below is a link to a picture of a socket 1366:
http://images.bit-tech.net/content_images/2009/02/ga-1366-cpu-cooler-group-test/33.jpg

OK, there is a lever that generates the spring mechanism, and at the bottom of the socket, as pictured, the spring engages a little tab.

Is that engagement of the spring to the tab the entire clamping force that is applied to the CPU?

Also, should the little tab that the spring engages be bent down, or should it have a trough in it that the spring sits in?

Just wondering, because I had a P6X58D Premium with a Lotes socket that looked just like the picture, and now I have the same motherboard with a Foxconn socket, and the spring barely hits the tab, and the tab is bent down.

I am assuming that the spring must apply force to that tiny tab to have a proper clamp on the CPU?

I am guessing the board will POST ok, but thought I would ask this first.

 

[MJinZ]

Picture = Correct.

/Thread

 

[aamsel]

Picture = Correct.

/Thread

I know that the picture is correct, I stated it.
I said "I had a P6X58D Premium with a Lotes socket that looked just like the picture"
My question is about the mechanical design of the socket itself.

 

[MJinZ]

No, that is not normal. Picture = correct. Others = not correct.

I have/had Foxconn boards, tons of them (EVGA X58s). You must wiggle the retention mechanism (tab) around so you get optimal contact with spring (clasp).

 

[aamsel]

...You must wiggle the retention mechanism (tab) around so you get optimal contact with spring (clasp).

The isssue is that as the spring starts to engage the clasp, it bends the clasp downward.

It seems ok when all is done, but with the clasp being bent, I can't see this working well for multiple CPU insertions?

I had known about the Foxconn vs Lotes stuff with the 1156, but I was not aware until now that Foxconn apparently makes inferior sockets to Lotes, even with the 1366.