pulling out hair over AS3 application!!!

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poMONKey

Senior member
Nov 11, 2002
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Originally posted by: Jeff7
I've not once bothered to do the whole thin layer thing, and I seem to have survived. I've relied on the pressure of the heatsink to press the heatsink compound to where it's needed - I just put maybe a tiny rice-grain (or smaller) sized bit of AS on the core of the processor, and clamp down the heatsink. It always seems to spread out evenly, and my temps are good. As for the P4, perhaps an owner of one could answer this: is the core of the CPU right in the center of the whole chip? If so, maybe a dab/tiny glob of ASIII right in the center would do the trick?

there is a heatspreader slab on the actual core that is the size of the whole chip... so applying just in the center isnt gonna work... does anyone know if i could remove the heatspreader and reapply it to make sure the thermal glue is done right??? does it matter???