• We’re currently investigating an issue related to the forum theme and styling that is impacting page layout and visual formatting. The problem has been identified, and we are actively working on a resolution. There is no impact to user data or functionality, this is strictly a front-end display issue. We’ll post an update once the fix has been deployed. Thanks for your patience while we get this sorted.

Production cycle of a graphics card

Hi, I'm trying to get a bit more information on the development cycle of a graphics card, does anyone know any good sources or can they shed some light?

Specifically ATI/AMD graphics and tape outs/spins of chips -

RV670, ATI's first 55 nanometre chip turns out to be better than anyone inside ATI expected. ATI planned to have the chip ready in very early Q1 next year but for the first time in ATI's history the A11 silicon doesn't need a re-spin

I thought that the first design of a chip would have been A0? or does graphics go through several designs before even getting taped out and silicone produced.

The barcelonas AMD demoed earlier were A1 silicon weren't they?

*posting here to keep dailytech from getting even more cluttered 😀
 
My hope: AMD-ATI beats, or matches Intel & Nvidia performance..

I'm talking next gen cpus and gpus.

I just want balance, aka I don't want either company to get too confident as not to give us new tech consistently.
 
The best way to know the chip design cycle is to get a degree in electrical engineering and work in one of those companies 😀

On a more serious note, I have first hand experience with this, and A11 is in fact the first spin (revision) of the chip.

After tape-out, typically, chips go through several fabrication revisions before they end up as a final product. Even then, additional revisions may be made to improve performance and yield. The spins are used to correct hardware bugs and timing problems.

Chips can have metal and base spins. Most of the revisions are done in metal spins as it is less expensive to redo the metalization layers compared to redoing the base layer. Only when there is a critical bug that cannot be fixed in the metalization layer is a base spin done.

Different companies have different conventions for labeling their spins.
 
Cheers MetaDFF.

I'm not an EE and it's unlikely I will end up working for any of the companies. So have you any other information you could share?

PM me if you want ;D
 
Back
Top