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Pressure on heatspreader...

freethrowtommy

Senior member
When I put on the TR120, it required a very good amount of pressure to get the clips down to the retension bracket... now my question is, is there TOO much pressure you can put on a CPU with the heat spreader? I know it is there to prevent cracked cores and the such, but can it be pushed too far or is it pretty hard to do...
 
You want it snug but too much and you could warp the board....Most of the sckt 939 mobos have the reinforcement plates on the back to prevent that but too much downforce could do damage to the socket....
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Well the IHS (integrated heat spreader) will keep you from cracking or chipping the core, so dont worry there...More likely you will damage the board...

 
so it would probably be best if you take the mobo out and lay it flat on cardboard or something like that to prevent it from putting too much pressure in one spot while raised in the case? or is the retension plate on the risers? i forgot to even look at that :S
 
I've done both in the case and outside w/ no issues. Personally, the pressure needed to lock the clips on a socket 939 mobo is nothing compared to trying to do it on a lga775 board.
 
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