Poll: HEAT SINK COMPOUND OR THERMAL PAD?

[Grigo]

I have a Abit KT7A, Duron 800, FOP32-1. I wish to run the cpu to 1G.
Global Win advise me that AMD ok this HSF to 1.33G as is, with the thermal pad. Reading back through previous Posts I see mention of
how to remove pads. What is the consensus please, do I leave it on?, if so do I apply HS compound to the chip core or should I just clip the HSF on as is with the pad. Also I propose to use a HB lead pencil to unlock, is that ok as the price of a silver conductive pen is $30 down here.

 

[compuwiz1]

Personally, I would remove it and use Arctic Silver. If you're not wanting to invest in Arctic Silver, then use the Pad. You'll be fine. It's better than silicon paste for Duron / Tbirds, since most of them will dry out and lose their effectiveness in a short time.