Info [pcworld] Xmems cooling chip (frore rival?)

[gorobei]

another mems chip using piezo motion for cooling. targeting smaller size/thinness for the phone market. previous products were mems speakers.

9mm x 7mm chip. 39 cubic cm/sec flow per chip, 1000pascal pressure, initial claim of 1/10 of the 1w claimed by frore.
currently in pre-production, production at tsmc and bosch. done on older 8in wafer node processes.

he talks about integration into chiplets and 2.5d stacking, i guess it could help with spreading out hotspots under the heatspreader.