According to the same Platform Conference, the memory manufacturers are going to start mass production of the faster PC2700 DDR SDRAM in H1?02 already. This new memory type will be supported by a number of upcoming chipsets for Pentium 4 and Athlon CPUs. In particular, the support for PC2700 DDR SDRAAM working at 333MHz was granted by such chipset manufacturers, as SiS and NVIDIA. The first solutions supporting this memory type are expected to appear in Q1?02.
The memory manufacturers claim however, that they will be able to start mass production of the new PC2700 DDR SDRAM due to the fact that 0.13micron technology will be fully implemented at that time. The shift to a new manufacturing process, will provide higher yields of chips with higher working frequency. Moreover, the memory chip makers are also going to change the chips packaging from TSOP to FBGA. The latter allows to improve the heat dissipation and reduces the EMI.
Other than that, the DDR SDRAM roadmap looks as follows. In H2?03 new PC3200 DDR SDRAM will appear. It will use DDR II protocol. In 2004, we can expect to see PC4300 DDR SDRAM. Then in 2005 we will see PC5400 DDR SDRAM.
The memory manufacturers claim however, that they will be able to start mass production of the new PC2700 DDR SDRAM due to the fact that 0.13micron technology will be fully implemented at that time. The shift to a new manufacturing process, will provide higher yields of chips with higher working frequency. Moreover, the memory chip makers are also going to change the chips packaging from TSOP to FBGA. The latter allows to improve the heat dissipation and reduces the EMI.
Other than that, the DDR SDRAM roadmap looks as follows. In H2?03 new PC3200 DDR SDRAM will appear. It will use DDR II protocol. In 2004, we can expect to see PC4300 DDR SDRAM. Then in 2005 we will see PC5400 DDR SDRAM.
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