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Paste Vs. Pad

Thermal paste is almost always better. The pads usually come with retail CPUs because they are cheap and easier to apply correctly than the paste.
 
Paste is always better. The pad they use on stock HSFs and what not are cheap Thermalpaste. You will get much better results with high quality past. For instance going from Stock to Artic Reference compound i dropper about 3C. By going to Arctic Silber 5 i dropped at least 10C if not more.

-Kevin
 
Pad if you're new. Paste if you feel comfortable.

Pad is better if it means you install it right, a bad paste job.. well...
 
paste is easier to tell that it would be better because a pad is flat and will not be able to go into the crevices/imperfections that the mating surfaces have. a paste will get into those crevices better than a pad and will make a better contact area for the two
 
Alright, the reason I asked this is because my friends says that a pad is more reliable which I could kinda agree, but then he says that his Pentium 4 2.4c is faster than my A64 3200+ Newcastle because his clock speed is higher. Then I told him about the PR rating and he said well he will overclock it to over 3.2ghz WITH THE PAD. Possible? I dont think so.
 
A64 will still beat it in most things BTW 😉

The pad (lol sounds like a drug 😛 ) is fine. THe Intel cooler is actually pretty good for mid range OCs. Going to a paste would be optimal but the pad wont restrict OC's in that range. However bringing that 2.4 to 3.2 will be interesting without overvolting, and high performance HSF.

-Kevin
 
AMD64 retail coolers ship with Shin-etsu T.I.M. which is excellent stuff so I would certainly not remove it to put some silver crap on there. I use Coolermaster premium and Ceramique' otherwise.
 
Originally posted by: Maxil223
Alright, the reason I asked this is because my friends says that a pad is more reliable which I could kinda agree, but then he says that his Pentium 4 2.4c is faster than my A64 3200+ Newcastle because his clock speed is higher. Then I told him about the PR rating and he said well he will overclock it to over 3.2ghz WITH THE PAD. Possible? I dont think so.
Click to expand...

The 2.4 P4 at stock speeds will easily be killed by your amd64 system with out a doubt. I can be considered an intel fan (in sig) but it's asinine to think that sh!tty p4 could outdo your system. Though if he is able to get to 3.4GHZ (high FSB) it's entirely possible he would kick your system's a$$ because of so much bandwidth (would also assume he is running the ram IN SYNC).
 
Depends on the application. I has some OCZ vid card ramsinks that came with pads pre-installed so I stuck with them. Otherwise I use thermal adhesive

But certainly never on a CPU heatsink, if you do there goes your CPU if you want a diff heatsink.

You guys use thermal adhesive between the CPU and the heatsink ?
 
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