neptunefix
Member
Okay, I just got a 2.4c (retail) in today. On the bottom of the HSF there is a black pad. There is no included paste. I went to intel's site where they give instructions. There is paste mentioned. It also says to press down hard.
1) is the black pad all I need? Does it melt on it's own to create a bond/connection?
2) how hard should I press down? I was a little confused on that part, too. I can't afford to screw this thing up. Damn, it sucks to be a n00b.
Thanks,
Neppy
1) is the black pad all I need? Does it melt on it's own to create a bond/connection?
2) how hard should I press down? I was a little confused on that part, too. I can't afford to screw this thing up. Damn, it sucks to be a n00b.
Thanks,
Neppy