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Opinions on New Thermal Interface Material

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Nanotherm

Junior Member
I'm the inventor of a new "Nanocomposite" thermal interface material, called Nanotherm (tm). As you know, thermal interface material is the stuff that bridges the gap between the processor core and the heat sink & fan assembly, filling the microscopic voids on each surface, eliminating (or reducing) air between surfaces, thereby, promoting the conductance of heat from the hotter surface to the cooler one.

My company, ESG Associates, has sent out pre-production samples of Nanotherm to a number of PC/Cooling Hardware Retailers and Gaming/Overclocking/Hardware Review sites for independent testing and evaluation. Based on the data we've gathered from our own testing and the preliminary feedback we've received from independent testers, it appears our Nanotherm material may be the equal of Artic Silver II in terms of performance - maybe even better in some areas.

We're finalizing our formulation, packaging and pricing right now and would appreciate some feedback from potential End-Users before we lock everything in for production. If you are interested in providing us with your opinion on 6 or 7 product related questions (off-forum via email), please contact us at esg@esgn.com.

We're only looking for feedback from about 25 people. The first 25 repondees are in and will receive a complimentary Pre-Production sample of our Nanotherm material for your own evaluation. If you're interested in participating, once again, contact us via email at esg@esgn.com.
 
Can you give us the scoop on Nanotherm?

Nanotherm could be completely different, but if Nanotherm is what I think it is, it is far from revolutionary. I had a pre-production of a similar product it when it was in its developmental stage. It was silver based, and looked like silver oxide. It was very smooth and consistant. It was also very runny, and very very conductive. Very runny and conductive on a CPU die is very bad. 🙁

I also had a developmental sample of a copper based material of the same idea. It seemed to transfer heat much better, but was still as runny and conductive. Only difference was color and it seemed to act like cornstarch and water, thus flowing like a liquid on its own, but when forced to move, it turns into a thick paste. Really bad for CPU dies, because it flowed out, and did not apply right due to the thickening factor.

Is this experience similar to the results of Nanotherm, or is Nanotherm a completely different material alltogether?
 
No, it is an altogether a unique and novel compound - the first of it's kind as far as I know - and as far as my patent searches have taken me. It is comprised of high tech, inert and non-toxic ceramic compounds in a non-silicone based carrier. It is, in fact, a true "Nanocomposite material," therefore, making it entirely different than any other thermal compound on the market. It is not 'runny' at all - Nanotherm has a fairly thick, viscous and 'sticky' consistency to it - more so than any other TIM I have evaluated. And, it's going to be cool blue - unlike any other TIM. Hope that answers a few questions.
 
Why not .. . . I'll answer the questions. I'm always in the mood to try out new "stuff". Email sent . . .
 
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