Originally posted by: BlueAcolyte
I note that this article says they are still releasing in February and March.
Also, WTF is FSB noise?
Intel uses a parallel bus system, as such, there are at least one routing for each bit in the bus for each block in the transaction. For Intel 64 bits, thus 64 separate lines ...
An electron traveling down a wire must be pushed by a voltage, a traveling electron will also lose energy as it travels and it loses that energy by giving off electromagnetic radiation. A wire next to another can then act as an antennea, absrobing that radiation and transmitting it back into the electrical stream this generates noise or cross talk.
http://www.google.com/search?s...s+signaling+cross+talk
You will find many papers, methods and techniques by which people study to find ways of transmission of digital signals cleanly without noise or cross-talk betwen adjacent runs. This is just the physics of traveling electrons and the engineering bussing systems.
In fact, if you look closely at various motherboards, you will see in the top one or two layers the electrical wiring between sockets, in some cases you can see a wiggle in the trace or a loop back and forth, for example see this image:
http://www.virtual-hideout.net...imits/images/07_sm.jpg
Look at the line traces right around the P and the R of the word 'PRO', notice some are wiggled, and between the 5 and the P a few loop back against each other...
This is done for several reasons, one is to break up the potential cross-signalling that may introduce noise into the line, other reasons are to match the total impedance and balance out the load to the two devices it is running between.
Nonetheless, with a dual die packaging, Intel has to be mindful of potential EM interferiences within the package, also spec the right voltage and strengths of the signal to the package, and design such that noise from one bit line will not corrupt the signal from a different bit line....
Despite people's jokes and inuendo's that the MCM is simply gluing together, this is quite abit of engineering that goes into the actual package, one might even say it is innovative for package technology (but that type of person would be one who knows what they are actually talking about).
Jack
> intermod or trace problems with signals jumping the traces on the motherboard and trashing other signals on nearby traces. 
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