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OK, got a new heatsink today

MikeyLSU

Platinum Member
my question is this:

Reading about it, it states that it normally takes about 200 hours for the thermal paste to harden and I guess become the most stable.

is it better to hold off major OCing until after a week of use or so? Or is it OK and temps may just slightly go down over time if I OC now.
 
OK, I just installed the HSF and I don't notice any temp diff at all on idle yet? Is this right?

I have an OC to 2.4 on an E4300 and my idle temps on TAT are around 55 just like they were before, in fact, they may be 1-2C higher.

I have the fan blowing towards the back of the case like it said to do. I don't get it.
 
You should have seen a significant drop. Are you sure you installed and seated it correctly? Sometimes things dont go right the first time and you have to redo it.
 
It felt right.

I cleaned off the old paste, mounted this one on, snapped everything in, secured the fan. I guess I'll do it all again, but any suggestions on other things I could do that would help?
 
ok, update, looks like one of the pins was bent so half the HS was not on the CPU. I fixed that and now my temps have gone down only about 5C from the stock HS. I was expecting a little more than that, oh well.

Edit: BTW, when I went and redid the HS, should I have taken all the Thermal Paste off the CPU? I left it all on since I was just putting the HS right back on it with teh same stuff anyway.
 
airflow seems fine...room temp is probably around 74-76F, but it was like that with the old HSF too.

I don't know, I didn't clean it off because I don't have any thermal paste to use, just what was already applied on the Freezer 7 pro.

BTW: My case is teh Antec Lanboy 2
 
My advice is to buy some AS5 and clean off *all* the old paste (from hsf and cpu) and apply the AS5 and see what you get.
 
My AC Freezer 64 Pro had a similar result. I lapped the heat spreader and the base of the heat sink( it was a bit rough and concave, not mirror finished like in reviews I've seen). I used OCZ Ultra 5+ compound and my temps are about 10 C cooler than when I received it. The OCZ compound was about 3C cooler than the compound that came with it before lapping. I'm getting a 35% overclock on my X2 3800+ which is fairly decent for this processor. If your heat sink base is not polished it may need lapping.
 
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