zephyrprime
Diamond Member
I bet the stripes spread out and fill all the pertinent area. It's probably done this way to prevent air gaps. They probably can't use the bead of arctic silver technique because the material they use is too viscous.
Originally posted by: Googer
Originally posted by: Operandi
Leave it as is; Intel knows what they are doing.
Nice pic btw.
Yep, Maximum PC proved that the stock TIM out performed any 3rd part goop avalable on the aftermarket.
Originally posted by: cmdrdredd
Originally posted by: Googer
Originally posted by: Operandi
Leave it as is; Intel knows what they are doing.
Nice pic btw.
Yep, Maximum PC proved that the stock TIM out performed any 3rd part goop avalable on the aftermarket.
Heh well, using As5 on the stock HSF gave me a 2c drop in temps when I was trying to decide whether or not to lapp my C2D IHS. Eventually I did lapp it because I couldn't get either my CNPS9500 or the stock HSF to get a good seat on the CPU.
The stock TIM even beat arctic siliver by a nice margin.Originally posted by: cmdrdredd
Originally posted by: Googer
Originally posted by: Operandi
Leave it as is; Intel knows what they are doing.
Nice pic btw.
Yep, Maximum PC proved that the stock TIM out performed any 3rd part goop avalable on the aftermarket.
Heh well, using As5 on the stock HSF gave me a 2c drop in temps when I was trying to decide whether or not to lapp my C2D IHS. Eventually I did lapp it because I couldn't get either my CNPS9500 or the stock HSF to get a good seat on the CPU.
Originally posted by: Googer
The stock TIM even beat arctic siliver by a nice margin.Originally posted by: cmdrdredd
Originally posted by: Googer
Originally posted by: Operandi
Leave it as is; Intel knows what they are doing.
Nice pic btw.
Yep, Maximum PC proved that the stock TIM out performed any 3rd part goop avalable on the aftermarket.
Heh well, using As5 on the stock HSF gave me a 2c drop in temps when I was trying to decide whether or not to lapp my C2D IHS. Eventually I did lapp it because I couldn't get either my CNPS9500 or the stock HSF to get a good seat on the CPU.
Originally posted by: zephyrprime
I bet the stripes spread out and fill all the pertinent area. It's probably done this way to prevent air gaps. They probably can't use the bead of arctic silver technique because the material they use is too viscous.
Originally posted by: Googer
Yep, Maximum PC proved that the stock TIM out performed any 3rd part goop avalable on the aftermarket.
Originally posted by: MS Dawn
This has been confirmed. Removing the HSF after a short period reveals a nice patch on both the processor and the copper bottom of the HS. 🙂
Originally posted by: JEDIYoda
Originally posted by: OCNewbie
Originally posted by: MS Dawn
Honestly it's not worth the hassle of removing it. I did that on my last HSF, got my hands all dirty for hardly half a degree difference and the readings are accurate to that. Never again. :|
http://forums.anandtech.com/messageview.aspx?catid=28&threadid=1929121
Read that, and take note that the ones dismissing the product have never tried it. In my experiences it makes cleaning the paste off the heatsinks a lot easier and less messy. I highly recommend it, as do about 154 or so other reviewers just on NewEgg's site.
Get the big bottles cheapest here I believe Link about $12.75 shipped for me to Florida.
thats just plain stoopid to recommend that she take the pads off when you have no clue what temps she will get using the pads!!
The pads will give you the same temps as using AS5 will give you!
AS5 is way over rated!!!!
take note those recommending taking the pads off have no clue whether you will get good temps or not!!
I will tell you from experience that you will get the same temps as if you were using AS5!!
Why go to all that work removing that stuff when you do not nee to??
Originally posted by: Baked
Saves Intel a bundle of money by putting on less TIM.
Who the hell uses the retail HSF anyway.