3d chip architecture! Killer sounding, especially the possible benefits. Now, to see it get off the ground...
http://www.dailynexus.com/news/2004/6670.html
http://www.sciencedaily.com/releases/2005/09/050910085819.htm
"The Boeing Company gave four patents to UCSB that describe technology used in making multi-layered, three-dimensional microchips. Kaustav Banerjee, an assistant professor of electrical and computer engineering, is leading the project and said he hopes to use the patents to build prototypes of the new chips.
A chemical etching process performed on a flat silicon wafer makes traditional integrated circuits, such as the Intel Pentium line. The new multi-layering techniques outlined in the patents describe how to build an integrated circuit in layers stacked to produce a three-dimensional shape, Banerjee said.
The new method saves space, by giving the integrated circuit a smaller footprint, but the real benefits include huge speed increases, versatility and lower heat production. Also, the prestige of having the patents may entice organizations to grant UCSB money for further research, Banerjee said."
"One of the major benefits of the stacked design is that the wiring from one part of the chip to another can be shorter, Banerjee said. In a conventional flat chip design, a wire must run from one edge clear across the surface to send a signal.
In a stacked design, the wire may be able to connect two layers vertically, which can be a much shorter distance. This design allows for much improved performance and lower heat production."
"Additionally, heat management is more of a problem in the three-dimensional integrated circuits than it is in conventional circuits because there is less surface area to dissipate the heat, Banerjee said.
?The fourth patent, which is also very important, relates to heat removal,? said Banerjee. ?When you make this 3-D package, the upper layers are going to generate heat, and typically the heatsink is attached to only one side of the chip.?
One of the patents describes a particular way to use tiny heat-moving devices called Peltier junctions to control the heat distribution within the layered integrated circuit."
Full story on their site. Very cool concept. Honestly, I was thinking this myself, a few minutes. I figured, heat dissipation would be difficult, speed of chips would increase, but had no idea if someone else had thought of it yet. Cool to see someone has! (No, I don't think I'm some sort of genius, just thought it'd be a cool concept. The human brain comes to mind, excuse the pun.)
P.S. - Looking for more information on similar technology. It may be defunct with new techs coming out for storage of data, but it looks promising. Will post any more cool stuff I find.
http://www.dailynexus.com/news/2004/6670.html
http://www.sciencedaily.com/releases/2005/09/050910085819.htm
"The Boeing Company gave four patents to UCSB that describe technology used in making multi-layered, three-dimensional microchips. Kaustav Banerjee, an assistant professor of electrical and computer engineering, is leading the project and said he hopes to use the patents to build prototypes of the new chips.
A chemical etching process performed on a flat silicon wafer makes traditional integrated circuits, such as the Intel Pentium line. The new multi-layering techniques outlined in the patents describe how to build an integrated circuit in layers stacked to produce a three-dimensional shape, Banerjee said.
The new method saves space, by giving the integrated circuit a smaller footprint, but the real benefits include huge speed increases, versatility and lower heat production. Also, the prestige of having the patents may entice organizations to grant UCSB money for further research, Banerjee said."
"One of the major benefits of the stacked design is that the wiring from one part of the chip to another can be shorter, Banerjee said. In a conventional flat chip design, a wire must run from one edge clear across the surface to send a signal.
In a stacked design, the wire may be able to connect two layers vertically, which can be a much shorter distance. This design allows for much improved performance and lower heat production."
"Additionally, heat management is more of a problem in the three-dimensional integrated circuits than it is in conventional circuits because there is less surface area to dissipate the heat, Banerjee said.
?The fourth patent, which is also very important, relates to heat removal,? said Banerjee. ?When you make this 3-D package, the upper layers are going to generate heat, and typically the heatsink is attached to only one side of the chip.?
One of the patents describes a particular way to use tiny heat-moving devices called Peltier junctions to control the heat distribution within the layered integrated circuit."
Full story on their site. Very cool concept. Honestly, I was thinking this myself, a few minutes. I figured, heat dissipation would be difficult, speed of chips would increase, but had no idea if someone else had thought of it yet. Cool to see someone has! (No, I don't think I'm some sort of genius, just thought it'd be a cool concept. The human brain comes to mind, excuse the pun.)
P.S. - Looking for more information on similar technology. It may be defunct with new techs coming out for storage of data, but it looks promising. Will post any more cool stuff I find.
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