You really need to use a low-power very fine tipped soldering iron, and very fine solder wire. Make sure you have plenty of copper desoldering braid to remove excess solder.
I've done lots of SOICs and 0805s by hand - and it was much easier when I changed soldering iron to one with a 0.12 mm bit.
Line up the chip with the lands on the board. The solder one of the corner pins. Check the position and solder the opposite corner. The solder the rest.
One thing to watch for is that the surface tension of the molten solder can pull the chip out of position when you solder the first joint. You should hold it in position with a clip while soldering. Another way (not as good), is to put a big blob of solder on one of the PCB lands, and then position the chip, and reflow the solder blob to make the first join.