bigtoe over at Asusboards.com has some results from a mobile P4 installed in his system. Check them out....what do you guy's think? 
Here's some info for those interested, taken from the Intel datasheet....
The Mobile Intel  Pentium  4 Processor-M is the first Intel mobile processor with the Intel
NetBurst TM micro-architecture. The Mobile Intel Pentium 4 Processor-M utilizes a 478-pin, Micro
Flip-Chip Pin Grid Array (Micro-FCPGA) package, and plugs into a surface-mount, Zero Insertion
Force (ZIF) socket. The Mobile Intel Pentium 4 Processor-M maintains full compatibility with IA-32
software.
The Intel NetBurst micro-architecture features include hyper-pipelined technology, a rapid
execution engine, a 400-MHz system bus, and an execution trace cache. The hyper pipelined
technology doubles the pipeline depth in the Mobile Intel Pentium 4 Processor-M allowing the
processor to reach much higher core frequencies. The rapid execution engine allows the two
integer ALUs in the processor to run at twice the core frequency, which allows many integer
instructions to execute in 1/2 clock tick. The 400-MHz system bus is a quad-pumped bus running
off a 100-MHz system clock making 3.2 GB/sec data transfer rates possible. The execution trace
cache is a first level cache that stores approximately 12-k decoded micro-operations, which
removes the instruction decoding logic from the main execution path, thereby increasing
performance.
The processor, when used in conjunction with the requisite Intel SpeedStep  technology applet or
its equivalent, supports Enhanced Intel SpeedStep technology, which enables real-time dynamic
switching of the voltage and frequency between two performance modes. This occurs by switching
the bus ratios, core operating voltage, and core processor speeds without resetting the system.
The Mobile Intel Pentium 4 Processor-M supports the THERMTRIP# signal for catastrophic
thermal protection. Alternatively an external thermal sensor can be used to protect the processor
and the system against excessive temperatures. Even with the activation of THERMTRIP#, which
halts all processor internal clocks and activity, leakage current can be high enough such that the
processor cannot be protected in all conditions without the removal of power to the processor. If the
external thermal sensor detects a catastrophic processor temperature of 135°C (maximum), or if the
THERMTRIP# signal is asserted, the VCC supply to the processor must be turned off within
500 ms to prevent permanent silicon damage due to thermal runaway of the processor.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
A thermal solution should be
designed to ensure the junction temperature never exceeds the 100°C
The Mobile Intel Pentium 4 Processor-M incorporates two methods of monitoring die temperature,
the Thermal Monitor and the thermal diode. The Thermal Monitor (detailed in Section 6.1.2) must
be used to determine when the maximum specified processor junction temperature has been
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter
(a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The thermal
diode may be used to monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum T J of the processor has
been reached.
The reading of the thermal sensor connected to the thermal diode does not reflect the temperature
of the hottest location on the die (T J ). This is due to inaccuracies in the thermal diode, on-die
temperature gradients between the location of the thermal diode and the hottest location on the die,
and time based variations in the die temperature. Time based variations can occur since the
sampling rate of the sensor is much slower than the die level temperature changes.
By using a factory-tuned, precision on-die thermal sensor, and a fast acting thermal
control circuit (TCC), the processor, without the aid of any additional software or hardware, can
keep the processor?s die temperature within factory specifications under nearly all conditions.
The Thermal Monitor controls the processor temperature by modulating (starting and stopping) the
processor core clocks.
Regardless of
enabling of the automatic or On-Demand modes, in the event of a catastrophic cooling failure, the
processor will automatically shut down when the silicon has reached a temperature of
approximately 135 °C.
The processor has two bus ratios and voltages programmed into it instead of one
and the GHI# signal controls which bus ratio and voltage is used. After reset, the processor will
start in the lower of its two core frequencies, the ?Battery Optimized? mode.
Here's some info for those interested, taken from the Intel datasheet....
The Mobile Intel  Pentium  4 Processor-M is the first Intel mobile processor with the Intel
NetBurst TM micro-architecture. The Mobile Intel Pentium 4 Processor-M utilizes a 478-pin, Micro
Flip-Chip Pin Grid Array (Micro-FCPGA) package, and plugs into a surface-mount, Zero Insertion
Force (ZIF) socket. The Mobile Intel Pentium 4 Processor-M maintains full compatibility with IA-32
software.
The Intel NetBurst micro-architecture features include hyper-pipelined technology, a rapid
execution engine, a 400-MHz system bus, and an execution trace cache. The hyper pipelined
technology doubles the pipeline depth in the Mobile Intel Pentium 4 Processor-M allowing the
processor to reach much higher core frequencies. The rapid execution engine allows the two
integer ALUs in the processor to run at twice the core frequency, which allows many integer
instructions to execute in 1/2 clock tick. The 400-MHz system bus is a quad-pumped bus running
off a 100-MHz system clock making 3.2 GB/sec data transfer rates possible. The execution trace
cache is a first level cache that stores approximately 12-k decoded micro-operations, which
removes the instruction decoding logic from the main execution path, thereby increasing
performance.
The processor, when used in conjunction with the requisite Intel SpeedStep  technology applet or
its equivalent, supports Enhanced Intel SpeedStep technology, which enables real-time dynamic
switching of the voltage and frequency between two performance modes. This occurs by switching
the bus ratios, core operating voltage, and core processor speeds without resetting the system.
The Mobile Intel Pentium 4 Processor-M supports the THERMTRIP# signal for catastrophic
thermal protection. Alternatively an external thermal sensor can be used to protect the processor
and the system against excessive temperatures. Even with the activation of THERMTRIP#, which
halts all processor internal clocks and activity, leakage current can be high enough such that the
processor cannot be protected in all conditions without the removal of power to the processor. If the
external thermal sensor detects a catastrophic processor temperature of 135°C (maximum), or if the
THERMTRIP# signal is asserted, the VCC supply to the processor must be turned off within
500 ms to prevent permanent silicon damage due to thermal runaway of the processor.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
A thermal solution should be
designed to ensure the junction temperature never exceeds the 100°C
The Mobile Intel Pentium 4 Processor-M incorporates two methods of monitoring die temperature,
the Thermal Monitor and the thermal diode. The Thermal Monitor (detailed in Section 6.1.2) must
be used to determine when the maximum specified processor junction temperature has been
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter
(a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The thermal
diode may be used to monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum T J of the processor has
been reached.
The reading of the thermal sensor connected to the thermal diode does not reflect the temperature
of the hottest location on the die (T J ). This is due to inaccuracies in the thermal diode, on-die
temperature gradients between the location of the thermal diode and the hottest location on the die,
and time based variations in the die temperature. Time based variations can occur since the
sampling rate of the sensor is much slower than the die level temperature changes.
By using a factory-tuned, precision on-die thermal sensor, and a fast acting thermal
control circuit (TCC), the processor, without the aid of any additional software or hardware, can
keep the processor?s die temperature within factory specifications under nearly all conditions.
The Thermal Monitor controls the processor temperature by modulating (starting and stopping) the
processor core clocks.
Regardless of
enabling of the automatic or On-Demand modes, in the event of a catastrophic cooling failure, the
processor will automatically shut down when the silicon has reached a temperature of
approximately 135 °C.
The processor has two bus ratios and voltages programmed into it instead of one
and the GHI# signal controls which bus ratio and voltage is used. After reset, the processor will
start in the lower of its two core frequencies, the ?Battery Optimized? mode.
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