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Micron and Intel Unveil New 3D NAND Flash Memory

dealcorn

Senior member
From the press release,http://investors.micron.com/releasedetail.cfm?ReleaseID=903522:
"Micron Technology, Inc. (Nasdaq: MU), and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device....The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring."

They claim "...First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND." Other significant benefits include lower energy use and fast speed. This sounds significant.
 
Old news tho:
http://www.anandtech.com/show/8749/intels-3d-nand-to-ship-in-h215-256gbit-die-32-layers

Screen%20Shot%202014-11-25%20at%2011.16.17_575px.png
 
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